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    Temperature control of electronic components
    2.
    发明授权
    Temperature control of electronic components 失效
    电子元件的温度控制

    公开(公告)号：US6041850A

    公开(公告)日：2000-03-28

    申请号：US747710

    申请日：1996-11-12

    申请人： Albert Andreas Maria Esser ,  James Patrick Lyons ,  Lyle Thomas Keister ,  Steven Wade Sutherland ,  Melvin La Vern Hughes ,  Howard Ross Edmunds ,  Stephen Daniel Nash ,  Paul Stephen Pate ,  Patrick Henry McGinn ,  Conrad Angelo Pecile

    发明人： Albert Andreas Maria Esser ,  James Patrick Lyons ,  Lyle Thomas Keister ,  Steven Wade Sutherland ,  Melvin La Vern Hughes ,  Howard Ross Edmunds ,  Stephen Daniel Nash ,  Paul Stephen Pate ,  Patrick Henry McGinn ,  Conrad Angelo Pecile

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/20945 ,  F28D15/0275 ,  H05K7/20936

    摘要： A system for temperature control of an electronic component includes a heat plate supporting the component; a heat plate temperature sensor; a fan capable of providing air for cooling the heat plate; and a fan control for using the heat plate temperature to control the operation of the fan to provide a substantially constant heat plate temperature. The system can further include a heat pipe assembly having fins and coupled to the heat plate with the fan capable of providing air to the fins. The heat pipe assembly can include at least two heat pipes each having first ends coupled to the heat plate and second ends situated in a condensation section where at least one of the heat pipes has a different working fluid than an other. A switch temperature or load current sensor can be coupled to the heat plate and supply data to a switch controller for receiving the switch temperature, determining whether the temperature or load current has changed, and adjusting a switching frequency of the at least one electronic switch device in response to any change of the switch temperature. A bus layer can be situated adjacent the component and selectively coated with an insulating material and studs can mechanically and electrically coupling the bus layer and a printed circuit board to the component. An insulating shield can be situated between the bus layer and the printed circuit board with the studs.

    摘要翻译： 电子部件的温度控制系统包括：支撑部件的加热板; 热板温度传感器; 能够提供用于冷却加热板的空气的风扇; 以及使用加热板温度来控制风扇的操作以提供基本上恒定的加热板温度的风扇控制。 该系统还可以包括具有翅片并且耦合到加热板的热管组件，其中风扇能够向翅片提供空气。 热管组件可以包括至少两个热管，每个热管具有联接到加热板的第一端和位于冷凝部分中的第二端，其中至少一个热管具有与另一个不同的工作流体。 开关温度或负载电流传感器可以耦合到加热板，并将数据提供给开关控制器以接收开关温度，确定温度或负载电流是否已经改变，以及调整至少一个电子开关器件的开关频率 响应于开关温度的任何变化。 总线层可以位于部件附近并且选择性地涂覆有绝缘材料，螺柱可以将总线层和印刷电路板机械地和电耦合到部件上。 绝缘屏蔽可以位于总线层和具有螺柱的印刷电路板之间。

    SYSTEMS, METHODS, AND APPARATUSES FOR BALANCING CAPACITOR LOAD
    6.
    发明申请
    SYSTEMS, METHODS, AND APPARATUSES FOR BALANCING CAPACITOR LOAD 审中-公开
    用于平衡电容负载的系统，方法和装置

    公开(公告)号：US20100020470A1

    公开(公告)日：2010-01-28

    申请号：US12179679

    申请日：2008-07-25

    申请人： Howard Ross Edmunds ,  Cyrus David Harbourt ,  Amy Marlene Ridenour ,  Jeffrey Alan Melius

    发明人： Howard Ross Edmunds ,  Cyrus David Harbourt ,  Amy Marlene Ridenour ,  Jeffrey Alan Melius

    IPC分类号： H01G4/38

    CPC分类号： H01G4/38

    摘要： Systems, methods, and apparatuses for balancing capacitor load are provided. A system includes a plurality of capacitors, a plurality of respective positive connections and a plurality of respective negative connections that connect each of the plurality of capacitors to at least one power source, where each of the plurality of positive connections has an approximately equal length, and each of the plurality of negative connections has an approximately equal length.

    摘要翻译： 提供了平衡电容器负载的系统，方法和设备。 一种系统包括多个电容器，多个相应的正连接和多个相应的负连接，其将多个电容器中的每一个连接到至少一个电源，其中多个正连接中的每一个具有大致相等的长度， 并且多个负连接中的每一个具有大致相等的长度。

    METHOD AND APPARATUS FOR COOLING ELECTRONICS
    7.
    发明申请
    METHOD AND APPARATUS FOR COOLING ELECTRONICS 有权
    冷却电子的方法和装置

    公开(公告)号：US20100128436A1

    公开(公告)日：2010-05-27

    申请号：US12324757

    申请日：2008-11-26

    申请人： Howard Ross Edmunds ,  Richard Kenneth McFalls

    发明人： Howard Ross Edmunds ,  Richard Kenneth McFalls

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources.

    摘要翻译： 本公开的实施例提供了用于改善散热器的散热特性以为电子设备（例如功率转换器）提供增加的冷却的方法和装置。 在一个实施例中，散热器包括至少一个流体冷却部分和邻近流体冷却部分设置的至少一个热管。 热管改善了热源远离热源的传导。

    Method and apparatus for cooling electronics
    8.
    发明授权
    Method and apparatus for cooling electronics 有权
    冷却电子元件的方法和装置

    公开(公告)号：US07796389B2

    公开(公告)日：2010-09-14

    申请号：US12324757

    申请日：2008-11-26

    申请人： Howard Ross Edmunds ,  Richard Kenneth McFalls

    发明人： Howard Ross Edmunds ,  Richard Kenneth McFalls

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources.

    摘要翻译： 本公开的实施例提供了用于改善散热器的散热特性以为电子设备（例如功率转换器）提供增加的冷却的方法和装置。 在一个实施例中，散热器包括至少一个流体冷却部分和邻近流体冷却部分设置的至少一个热管。 热管改善了热源远离热源的传导。