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公开(公告)号:US20170165790A1
公开(公告)日:2017-06-15
申请号:US14969695
申请日:2015-12-15
发明人: Thomas Francis McCarthy , Brock Miller , Robin Stamp , Yuri Zaitsev , Robert Klein , Mark Esformes , David Markel , Amit Mistry , Joseph Robinson
IPC分类号: B23K26/342 , B28B1/00 , B29C67/00
CPC分类号: B23K26/342 , A61F2/0063 , A61L27/56 , B22F3/1055 , B22F3/1103 , B28B1/001 , B29C64/135 , B29C64/153 , B29L2031/772 , B33Y10/00 , B33Y80/00 , Y02P10/295
摘要: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.
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公开(公告)号:US10596660B2
公开(公告)日:2020-03-24
申请号:US14969695
申请日:2015-12-15
发明人: Thomas Francis McCarthy , Brock Miller , Robin Stamp , Yuri Zaitsev , Robert Klein , Mark Esformes , David Markel , Amit Mistry , Joseph Robinson
IPC分类号: B23K26/342 , B23K1/00 , B29C67/00 , B29C64/153 , A61L27/56 , B22F3/11 , B22F3/105 , B29C64/135 , A61F2/00 , B28B1/00 , B33Y80/00 , B33Y10/00 , B29L31/00
摘要: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.
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