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公开(公告)号:US20190290550A1
公开(公告)日:2019-09-26
申请号:US16360394
申请日:2019-03-21
申请人: Huakun XU , Su-Ping WANG , Mark A. REYNOLDS , Abraham SCHNEIDER
发明人: Huakun XU , Su-Ping WANG , Mark A. REYNOLDS , Abraham SCHNEIDER
IPC分类号: A61K6/00 , A61K31/155 , A61K31/14 , A61K33/38 , A61K33/42
摘要: The present invention provides metformin-containing dental materials that can be widely applied in a variety of dental applications. The metformin-containing dental materials of the invention include metformin-containing dental primers, metformin-containing dental adhesives, metformin-containing dental resins, metformin-containing dental composites, metformin-containing dental bonding systems and the like, as well as metformin-containing dental cements, metformin-containing dental sealants, metformin-containing dental bases and metformin-containing dental liners.