公开(公告)号：US20220201837A1

公开(公告)日：2022-06-23

申请号：US17559763

申请日：2021-12-22

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhaozheng HOU ,  Xiaojing LIAO ,  Chao SHEN ,  Dongxing WANG

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

Abstract: The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.