公开(公告)号：US20230036995A1

公开(公告)日：2023-02-02

申请号：US17874594

申请日：2022-07-27

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Xiaojing LIAO ,  Hao PENG

IPC: H05K1/11 ,  H05K1/02

Abstract: A power supply module includes a main body, a first solder pad, and a plurality of metal connection pillars. The main body has a first surface and a second surface. The main body includes a package body, a package base layer, and a power chip. The package base layer, the power chip, and the first solder pad are all disposed in the package body. The power chip is connected to the package base layer. An end of the power chip away from the package base layer is connected to the first solder pad. Each metal connection pillar has a first end connected to the first solder pad and a second end extending through the main body to an outer side of the first surface of the main body.

公开(公告)号：US20240321761A1

公开(公告)日：2024-09-26

申请号：US18653619

申请日：2024-05-02

Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.

Inventor： Hao PENG ,  Xiaojing LIAO

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/367 ,  H01L23/522 ,  H01L23/66 ,  H01L25/16

CPC classification number: H01L23/5386 ,  H01L23/367 ,  H01L23/5223 ,  H01L23/5383 ,  H01L23/66 ,  H01L24/08 ,  H01L25/16 ,  H01L2223/6666 ,  H01L2224/08245 ,  H01L2924/1815

Abstract: A power module includes: an insulation layer, a plurality of conductive layers, a decoupling capacitor, and a plurality of first components, where the insulation layer includes a plurality of sub-insulation layers stacked in a thickness direction of the power module, and the sub-insulation layer is disposed between every two adjacent conductive layers. The first component is located at a sub-insulation layer in a first region and is electrically connected to a conductive layer adjacent to the sub-insulation layer at which the first component is disposed, and at least some of the first components are stacked in the thickness direction of the power module. The insulation layer located in the first region has an auxiliary accommodation cavity, the decoupling capacitor is located in the auxiliary accommodation cavity, the pins of the decoupling capacitor is electrically connected to the plurality of conductive layers.

公开(公告)号：US20220201837A1

公开(公告)日：2022-06-23

申请号：US17559763

申请日：2021-12-22

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhaozheng HOU ,  Xiaojing LIAO ,  Chao SHEN ,  Dongxing WANG

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

Abstract: The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.