公开(公告)号：US20220338371A1

公开(公告)日：2022-10-20

申请号：US17711843

申请日：2022-04-01

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Chunxia XU ,  Jun CHEN ,  Xiaowei HUI ,  Hao WU

IPC: H05K7/20 ,  H01R24/68 ,  H01R13/66

Abstract: A power adapter and a manufacturing method thereof are provided. The power adapter includes a housing, a circuit board assembly, and a first heat dissipation part. There is accommodation space inside the housing, a line interface is disposed at a first end of the housing, and a power connector is disposed at a second end of the housing. The circuit board assembly is disposed in the accommodation space, and the circuit board assembly is electrically connected to the line interface and the power connector. The first heat dissipation part coats the outside of the circuit board assembly, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing.

公开(公告)号：US20220256733A1

公开(公告)日：2022-08-11

申请号：US17665225

申请日：2022-02-04

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hao WU ,  Jun CHEN ,  Chunxia XU ,  Xiaowei HUI

IPC: H05K7/20 ,  H01R24/68 ,  H01R13/66

Abstract: A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.