WIRELESS CHARGER
    1.
    发明申请

    公开(公告)号:US20230014262A1

    公开(公告)日:2023-01-19

    申请号:US17947688

    申请日:2022-09-19

    Abstract: Embodiments of this application provide a wireless charger, and relate to the field of charging device technologies. The wireless charger includes a wireless charging module, a first fan, a housing including a contact plate used for contact with the rear surface of the terminal device, and an air intake vent disposed at a position that is of the housing and that is close to the first fan, and an airflow guide structure disposed on a side that is of the housing and that is adjacent to the contact plate. The airflow guide structure extends toward the display surface of the terminal device.

    WIRELESS CHARGING BASE
    2.
    发明申请

    公开(公告)号:US20220217866A1

    公开(公告)日:2022-07-07

    申请号:US17704996

    申请日:2022-03-25

    Abstract: A wireless charging base is provided, and is mainly applied to electronic devices such as a mobile phone and a tablet computer. The wireless charging base includes a charging panel, configured to charge the electronic device. The charging panel includes a first air vent and a second air vent. A first base plate is disposed on an upper surface of the charging panel, is located at an end of the charging panel, and is configured to support the electronic device when the electronic device is being charged. The first base plate includes a third air vent. A second base plate is disposed on the lower surface of the charging panel, is located at the same end as the first base plate, and is configured to support the charging panel. The second base plate includes a fourth air vent.

    WIRELESS CHARGER
    3.
    发明申请

    公开(公告)号:US20220256732A1

    公开(公告)日:2022-08-11

    申请号:US17579770

    申请日:2022-01-20

    Abstract: The wireless charger includes a housing, a circuit board component, and a heat conduction structure. The housing has a first air inlet and a first air outlet, and a heat dissipation air channel that communicates with the first air inlet and the first air outlet and that is located inside the housing. is formed between the first air inlet and the first air outlet. The circuit board component is located in the heat dissipation air channel. The heat conduction structure includes a contact part and a connection part that are connected to each other, at least a part of the contact part is exposed to an outer surface of the housing, the contact part is configured to be in contact with a to-be-charged device, and the connection part is located inside the housing and is in contact with the heat dissipation air channel.

    POWER ADAPTER AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220338371A1

    公开(公告)日:2022-10-20

    申请号:US17711843

    申请日:2022-04-01

    Abstract: A power adapter and a manufacturing method thereof are provided. The power adapter includes a housing, a circuit board assembly, and a first heat dissipation part. There is accommodation space inside the housing, a line interface is disposed at a first end of the housing, and a power connector is disposed at a second end of the housing. The circuit board assembly is disposed in the accommodation space, and the circuit board assembly is electrically connected to the line interface and the power connector. The first heat dissipation part coats the outside of the circuit board assembly, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing.

    POWER ADAPTER
    5.
    发明申请

    公开(公告)号:US20220256733A1

    公开(公告)日:2022-08-11

    申请号:US17665225

    申请日:2022-02-04

    Abstract: A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.

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