公开(公告)号：US20250112109A1

公开(公告)日：2025-04-03

申请号：US18980586

申请日：2024-12-13

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Mirko Bernardoni ,  Gilberto Curatola

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/373 ,  H01L25/07

Abstract: A semiconductor package comprises: a thermally conductive layer and semiconductor devices thermally connected with the thermally conductive layer. The semiconductor devices produce heat, which the thermally conductive layer dissipates at least partly. Some heat is transferred from a semiconductor device to another semiconductor device. The semiconductor package further comprises a temperature balancing element arranged in thermal connection i) with the thermally conductive layer and ii) with the other semiconductor device(s).

公开(公告)号：US20250079332A1

公开(公告)日：2025-03-06

申请号：US18952995

申请日：2024-11-19

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Andreas Munding ,  Lasse Petteri Palm ,  Gilberto Curatola

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H02M7/00

Abstract: The disclosure relates to a power converter package (100) for converting a first DC voltage and a second DC voltage into a common AC voltage. The power converter package comprises: a first power semiconductor (130) and a second power semiconductor (140); a first substrate (110); and a second substrate (120). The first substrate (110) comprises a first supply voltage area (113) being formed to supply the first DC voltage and a second supply voltage area (114) being formed to supply the second DC voltage. The first substrate (110) comprises a base metal area (115) being arranged on a first substrate lower main face (112). The base metal area (115) is configured to extract dissipated heat from the first power semiconductor (130) and the second power semiconductor (140). The second substrate (120) comprises an AC voltage output area (150) formed to provide the AC voltage.