公开(公告)号：US20250112109A1

公开(公告)日：2025-04-03

申请号：US18980586

申请日：2024-12-13

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Mirko Bernardoni ,  Gilberto Curatola

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/373 ,  H01L25/07

Abstract: A semiconductor package comprises: a thermally conductive layer and semiconductor devices thermally connected with the thermally conductive layer. The semiconductor devices produce heat, which the thermally conductive layer dissipates at least partly. Some heat is transferred from a semiconductor device to another semiconductor device. The semiconductor package further comprises a temperature balancing element arranged in thermal connection i) with the thermally conductive layer and ii) with the other semiconductor device(s).