公开(公告)号：US20220212517A1

公开(公告)日：2022-07-07

申请号：US17591491

申请日：2022-02-02

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Shuliang YU ,  Yanzhong WANG ,  Jiongde CHEN ,  Shaohua WANG

IPC: B60H1/00 ,  B60H1/32 ,  B60H1/14

Abstract: This application provides a thermal management system. The thermal management system includes a refrigerant loop and a motor coolant loop. The refrigerant loop and the motor coolant loop jointly include a low pressure chiller. The low pressure chiller is configured to enable a refrigerant in the refrigerant loop to absorb heat from a motor coolant in the motor coolant loop, to heat a target temperature-controlled space and/or a target temperature-controlled device. Therefore, a temperature of the motor coolant may be relatively low on a basis that a required heating temperature can be achieved, so that a difference between the temperature of the motor coolant and an ambient temperature is relatively small. In this way, heat loss caused by dissipation of heat from a motor to a surrounding environment can be reduced, thereby improving utilization of the heat from the motor.