公开(公告)号：US12133321B2

公开(公告)日：2024-10-29

申请号：US17988222

申请日：2022-11-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Junpeng Kang ,  Zhuyong Huang ,  Bo Xiao ,  Wenhai Yao

IPC: G06F1/16 ,  H05K1/02 ,  H05K5/00 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/2039

Abstract: An electronic device includes a heat dissipation part, a plurality of electronic components, and a fixed potential part. The electronic component is fastened to the heat dissipation part, and an insulation pad is disposed between the electronic component and the heat dissipation part. The fixed potential part has a fixed potential, and the heat dissipation part is electrically connected to the fixed potential part. The heat dissipation part has the fixed potential, a potential difference between the electronic component and the heat dissipation part is reduced, and a requirement of a safety specification between the electronic component and the heat dissipation part is reduced. The electronic component can be relatively close to the heat dissipation part, and a surrounding energized component of the heat dissipation part can also be closer to the heat dissipation part.

公开(公告)号：US20230073713A1

公开(公告)日：2023-03-09

申请号：US17988222

申请日：2022-11-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Junpeng Kang ,  Zhuyong Huang ,  Bo Xiao ,  Wenhai Yao

IPC: H05K1/02 ,  H05K7/20

Abstract: An electronic device includes a heat dissipation part, a plurality of electronic components, and a fixed potential part. The electronic component is fastened to the heat dissipation part, and an insulation pad is disposed between the electronic component and the heat dissipation part. The fixed potential part has a fixed potential, and the heat dissipation part is electrically connected to the fixed potential part. The heat dissipation part has the fixed potential, a potential difference between the electronic component and the heat dissipation part is reduced, and a requirement of a safety specification between the electronic component and the heat dissipation part is reduced. The electronic component can be relatively close to the heat dissipation part, and a surrounding energized component of the heat dissipation part can also be closer to the heat dissipation part.