公开(公告)号：US20240121901A1

公开(公告)日：2024-04-11

申请号：US18477392

申请日：2023-09-28

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Chunyan Zhao ,  Chao Shen ,  Kuanming Bao

IPC: H05K1/18 ,  H01L23/373 ,  H01L23/538

CPC classification number: H05K1/186 ,  H01L23/3736 ,  H01L23/5383 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: This application provides an embedded package structure, a power supply apparatus, and an electronic device. First electronic components with smaller sizes are stacked, and then arranged in a substrate frame in a two-dimensional manner with a larger-size inductor component to form an embedded package structure. Then, a chip is disposed on the embedded package structure, so that the chip serving as a main heat source is placed on a surface of the power supply apparatus.