公开(公告)号：US20230083147A1

公开(公告)日：2023-03-16

申请号：US17990076

申请日：2022-11-18

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hui WANG ,  Peng CHENG

IPC: F25B1/00 ,  F25B41/31 ,  H05K7/20

Abstract: A refrigerant pump and a data center cooling system. The data center cooling system includes a refrigerant connected between a condenser and an evaporator. The refrigerant includes a housing, a partition plate, and a pump head. The housing is provided with a liquid inlet and a liquid outlet. The partition plate is disposed inside the housing, and they jointly form first space and second space. A pump body includes the pump head and a motor. An inlet of the pump head is located at the bottom of the first space in a gravity direction. The motor is located in the second space. The pump head is configured to transfer refrigerant in the first space to the second space. The liquid inlet is directly connected to the condenser by using a pipeline. The first space is configured to store refrigerant of the data center cooling system.