公开(公告)号：US20240096782A1

公开(公告)日：2024-03-21

申请号：US18468362

申请日：2023-09-15

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Bo Yu ,  Xudong Wang ,  Xin Li

IPC: H01L23/498 ,  H01L23/373 ,  H01L25/07

CPC classification number: H01L23/49894 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L24/48 ,  H01L2224/48137

Abstract: A packaging device includes a first circuit substrate and a second circuit substrate that are electrically connected. The first circuit substrate includes a first line layer and a first insulation layer that are sequentially stacked, and a first electronic component is disposed on the first circuit substrate. The second circuit substrate includes a second line layer and a second insulation layer that are sequentially stacked, and a second electronic component is disposed on the second circuit substrate. A thermal conductivity of the first insulation layer is higher than a thermal conductivity of the second insulation layer. This application further provides a packaging module and an electronic device in which the packaging device is used. The packaging device in this application, the first insulation layer and the second insulation layer with different thermal conductivities are targetedly configured, and layouts of the first circuit substrate and the second circuit substrate are flexible.