CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

    公开(公告)号:US20240324093A1

    公开(公告)日:2024-09-26

    申请号:US18679711

    申请日:2024-05-31

    CPC classification number: H05K1/0203 H05K1/14 H05K9/0024

    Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. In the circuit board assembly, at least one first shielding component is disposed on a periphery of a chip component, each first shielding component includes a shielding frame and a shielding cover, an end that is of the shielding frame and that is away from the shielding cover is fastened to a first circuit board, at least a part of the shielding cover is located between the chip component and a heat sink, and the shielding cover is movably connected to the shielding frame, so that the shielding cover can move in a vertical direction relative to the shielding frame. In this way, the first shielding component can adapt to chip components of different heights and different assembly gaps.

    ADAPTER ASSEMBLY AND OPTICAL COMMUNICATIONS DEVICE

    公开(公告)号:US20220413227A1

    公开(公告)日:2022-12-29

    申请号:US17849362

    申请日:2022-06-24

    Abstract: This application discloses an adapter assembly and an optical communications device, and belongs to the field of connector technologies. The adapter assembly is configured to be installed on a hole of a panel, and the adapter assembly includes: an MT/MPO adapter, where the MT/MPO adapter includes a flange plate, an MT port, and an MPO port, the MT port and the MPO port are respectively located on two sides of the flange plate in a thickness direction, and the MPO port is configured to be connected to an MPO plug; and an MT plug, where the MT plug includes an MT optical fiber and an MT clamp that are connected, and the MT plug is connected to the MT port. The flange plate is made of conductive plastic. This application can shield an electromagnetic wave in the optical communications device.

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