公开(公告)号：US20210313366A1

公开(公告)日：2021-10-07

申请号：US17266057

申请日：2018-08-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Atsushi YAJIMA ,  Kun RAN ,  Zhendong LUO ,  Lifeng FU ,  Weichih LIN ,  Changfu HUANG

IPC: H01L27/146

Abstract: A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.