公开(公告)号：US20190265461A1

公开(公告)日：2019-08-29

申请号：US16408098

申请日：2019-05-09

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhenlin XIE ,  Zhenkai QIN ,  Kun RAN

IPC: G02B26/08 ,  G02B7/182 ,  H04N5/225

Abstract: A camera module is disclosed. The camera module includes a rotatable reflector, a lens group, a housing, and an image sensor. The housing includes a first surface and a second surface. A first mirror surface of the rotatable reflector is a reflective surface, and a part of the first mirror surface located in a first reflective area is a first sub mirror surface. When the rotatable reflector is located at a first position, the first mirror surface reflects a first optical signal. An image is generated after the reflected first optical signal is transmitted along a straight line along which an optical axis lies. When the rotatable reflector is located at a second position, the first mirror surface reflects a second optical signal. An image is generated after the reflected second optical signal is transmitted along the straight line along which the optical axis lies.

公开(公告)号：US20210313366A1

公开(公告)日：2021-10-07

申请号：US17266057

申请日：2018-08-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Atsushi YAJIMA ,  Kun RAN ,  Zhendong LUO ,  Lifeng FU ,  Weichih LIN ,  Changfu HUANG

IPC: H01L27/146

Abstract: A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.

公开(公告)号：US20210075940A1

公开(公告)日：2021-03-11

申请号：US16952984

申请日：2020-11-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xi CAO ,  Kun RAN ,  Xiangyong QING

IPC: H04N5/225 ,  G02B5/20 ,  G02B7/00 ,  G03B11/00

Abstract: This application provides example camera assemblies and example assembly methods. One example method includes plastic-packaging a surface mount electronic component and an image sensor to form a target plastic-packaged module, where the target plastic-packaged module includes an active surface, and where a solder end of the surface mount electronic component and a solder end of the image sensor are exposed on the active surface. A redistribution layer (RDL) can then be prepared and the RDL can then be drilled to form a through-hole, where the through-hole is opposite to a photosensitive area of the image sensor, where the RDL includes a dielectric layer and metal wiring disposed at the dielectric layer. The metal wiring exposed on the first surface of the RDL can then be connected to a solder end on the active surface of the target plastic-packaged module.