公开(公告)号：US20240075710A1

公开(公告)日：2024-03-07

申请号：US18502254

申请日：2023-11-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dawei Ji ,  Ming Cai ,  Banghong Hu

IPC: B32B15/01 ,  H05K5/04

CPC classification number: B32B15/017 ,  H05K5/04

Abstract: This application provides a housing, a terminal device, and a housing manufacturing method. The housing includes a magnesium-based metal matrix. A first aluminum-based metal layer and a second aluminum-based metal layer are respectively disposed on two sides of the magnesium-based metal matrix, a first transition layer is disposed between the magnesium-based metal matrix and the first aluminum-based metal layer, an appearance layer is disposed on a surface of a side that is of the first aluminum-based metal layer and that is away from the first transition layer, a second transition layer is disposed between the magnesium-based metal matrix and the second aluminum-based metal layer, and an electrical connection layer is disposed on a surface of a side that is of the second aluminum-based metal layer and that is away from the second transition layer.