公开(公告)号：US20240075710A1

公开(公告)日：2024-03-07

申请号：US18502254

申请日：2023-11-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dawei Ji ,  Ming Cai ,  Banghong Hu

IPC: B32B15/01 ,  H05K5/04

CPC classification number: B32B15/017 ,  H05K5/04

Abstract: This application provides a housing, a terminal device, and a housing manufacturing method. The housing includes a magnesium-based metal matrix. A first aluminum-based metal layer and a second aluminum-based metal layer are respectively disposed on two sides of the magnesium-based metal matrix, a first transition layer is disposed between the magnesium-based metal matrix and the first aluminum-based metal layer, an appearance layer is disposed on a surface of a side that is of the first aluminum-based metal layer and that is away from the first transition layer, a second transition layer is disposed between the magnesium-based metal matrix and the second aluminum-based metal layer, and an electrical connection layer is disposed on a surface of a side that is of the second aluminum-based metal layer and that is away from the second transition layer.

公开(公告)号：US10143110B2

公开(公告)日：2018-11-27

申请号：US15971914

申请日：2018-05-04

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ming Cai ,  Banghong Hu ,  Longyu Li

IPC: H05K7/20 ,  H04M1/02 ,  G06F1/16 ,  G06F1/20

Abstract: Embodiments of the present disclosure provide a middle frame member including: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer.

公开(公告)号：US20230383389A1

公开(公告)日：2023-11-30

申请号：US18447116

申请日：2023-08-09

Applicant: HUAWEI TECHNOLOGIES CO., LTD. ,  ZoltrixMaterial (Guangzhou) Limited

Inventor： Wei Yuan ,  Ming Cai ,  Xiaoming Xu ,  Jiahao Huang

IPC: C22C38/10 ,  C22C38/12 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C33/04 ,  B22F9/08 ,  B22F3/22 ,  B22F3/10 ,  B22F3/24 ,  H04M1/02

CPC classification number: C22C38/105 ,  C22C38/12 ,  C22C38/005 ,  C22C38/002 ,  C22C38/004 ,  C22C38/02 ,  C22C38/04 ,  C22C33/04 ,  B22F9/082 ,  B22F3/225 ,  B22F3/1021 ,  B22F3/1007 ,  B22F3/24 ,  H04M1/0216 ,  B22F2999/00 ,  B22F2998/10 ,  B22F2304/10 ,  B22F2009/0824 ,  B22F2003/248

Abstract: A steel material is disclosed. The steel material includes components in the following mass percentages: 14% to 20% of nickel, 7.5% to 11% of cobalt, 4% to 7% of molybdenum, to 0.5% of rhenium and/or a rare earth element, less than or equal to 0.2% of manganese, less than or equal to 0.2% of silicon, less than or equal to 0.1% of carbon, less than or equal to of oxygen, iron, and inevitable impurities. The steel mechanical part is made of the steel material. The preparation method includes: mixing alloy powder and a binder to prepare feed particles; performing injection molding on the feed particles to obtain an injection green billet of the steel mechanical part; performing debinding and sintering on the injection green billet in sequence to obtain a sintered blank; and performing heat treatment on the sintered blank to obtain the steel mechanical part.

公开(公告)号：US20230176616A1

公开(公告)日：2023-06-08

申请号：US18163798

申请日：2023-02-02

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhiyu Cao ,  Ming Cai ,  Huiting Zhong

IPC: G06F1/16

CPC classification number: G06F1/1626 ,  G06F1/1656

Abstract: This application provides a housing structure, a production method thereof, and an electronic device. The housing structure includes an appearance effect layer, a metal layer, a connection layer, and a non-metal layer that are laminated. The connection layer is configured to bind the metal layer and the non-metal layer. The appearance effect layer is formed after surface processing is performed on the metal layer. The housing structure includes both the metal layer and the non-metal layer. The metal layer and the non-metal layer are bound by using the connection layer, so that the housing structure has advantages of a metal layer housing and a non-metal layer housing. In addition, the appearance effect layer formed after surface processing is performed on the metal layer can ensure that the housing structure has a metallic appearance with an aesthetic appeal.

公开(公告)号：US10348013B2

公开(公告)日：2019-07-09

申请号：US15872989

申请日：2018-01-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ming Cai

IPC: H04B1/3818 ,  H01R12/71 ,  H01R13/629 ,  H04M1/02 ,  H04B1/3816 ,  C23C14/06 ,  C23C16/26 ,  H01R13/518

Abstract: A card tray for holding a card in a mobile terminal, a method for preparing the card tray, and a mobile terminal are disclosed. The card tray includes a card tray base, a first insulation layer disposed on the card tray base, and a second insulation layer covering the first insulation layer. Hardness of the first insulation layer is higher than hardness of the second insulation layer. When inserting a card to a mobile terminal, burrs or sharp parts on the card may pierce the second insulation layer, whereas the first insulation layer can block the burrs or the sharp parts, preventing an insulation coating on the card tray base from being scratched.

公开(公告)号：US20180145433A1

公开(公告)日：2018-05-24

申请号：US15872989

申请日：2018-01-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ming Cai

IPC: H01R12/71 ,  H01R13/518 ,  H01R13/629 ,  C23C14/06 ,  C23C16/26 ,  H04B1/3818

CPC classification number: H01R12/71 ,  C23C14/06 ,  C23C16/26 ,  H01R13/518 ,  H01R13/629 ,  H04B1/3816 ,  H04B1/3818 ,  H04M1/02

Abstract: A card tray for holding a card in a mobile terminal, a method for preparing the card tray, and a mobile terminal are disclosed. The card tray includes a card tray base, a first insulation layer disposed on the card tray base, and a second insulation layer covering the first insulation layer. Hardness of the first insulation layer is higher than hardness of the second insulation layer. When inserting a card to a mobile terminal, burrs or sharp parts on the card may pierce the second insulation layer, whereas the first insulation layer can block the burrs or the sharp parts, preventing an insulation coating on the card tray base from being scratched.

公开(公告)号：US20240081710A1

公开(公告)日：2024-03-14

申请号：US18514111

申请日：2023-11-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yujian Huang ,  Qiu Jin ,  Ming Cai ,  Longyu Li

IPC: A61B5/263 ,  A61B5/28 ,  C23C14/06 ,  C23C14/34

CPC classification number: A61B5/263 ,  A61B5/28 ,  C23C14/0605 ,  C23C14/34 ,  A61B2562/0285 ,  A61B2562/125

Abstract: An ECG electrode is provided. The ECG electrode includes an electrode substrate and a doped graphite-like carbon film located on an outer surface of the electrode substrate. The doped graphite-like carbon film includes graphite-like carbon, and first nano-crystals and second nano-crystals that are embedded in the graphite-like carbon. The first nano-crystal includes a weak carbon-bonding element. The weak carbon-bonding element has a part that exists in a form of a metallic elementary substance. The first nano-crystal includes a columnar structure. The columnar structure extends in a thickness direction of the doped graphite-like carbon film. The second nano-crystal includes a strong carbon-bonding element. The strong carbon-bonding element bonds with the carbon element in the graphite-like carbon through a chemical bond. The second nano-crystals are distributed between adjacent and spaced columnar structures. The ECG electrode has high hardness and excellent wear resistance while ensuring excellent electrocardiography signal quality.

公开(公告)号：US20230212721A1

公开(公告)日：2023-07-06

申请号：US18174373

申请日：2023-02-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD. ,  Shenzhen ElementPlus Material Technology Co., Ltd.

Inventor： Xiaoming Xu ,  Ming Cai ,  Wei Yuan ,  Yonghu Lv ,  Wei Mo

IPC: C22C38/52 ,  C22C38/48 ,  C22C38/44 ,  C22C38/04 ,  C22C38/02 ,  C22C38/00 ,  H01F1/147

CPC classification number: C22C38/52 ,  C22C38/48 ,  C22C38/44 ,  C22C38/04 ,  C22C38/02 ,  C22C38/002 ,  H01F1/14708 ,  B22F3/225

Abstract: A steel, a steel mechanical part, an electronic device, and a preparation method for a steel mechanical part are provided. The steel includes components of the following mass percentages: chromium: 7% to 11%, nickel: 2% to 7.5%, cobalt: 6% to 15%, molybdenum: 4% to 7%, oxygen: a trace to 0.4%, carbon: a trace to 0.35%, and iron: 50% to 80%. The steel provided in this application has relatively high mechanical strength and is not easily deformed, and therefore a risk of fracture caused when an electronic device using the steel falls off from a height is reduced.

公开(公告)号：US20230220525A1

公开(公告)日：2023-07-13

申请号：US18173608

申请日：2023-02-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD. ,  Shanghai Future High-tech Co., Ltd.

Inventor： Longyu Li ,  Ming Cai ,  Mantang Duan ,  Meiling Zhu ,  Zhongyong Deng

IPC: C22C33/02 ,  C22C38/58 ,  C22C38/56 ,  C22C38/50 ,  C22C38/48 ,  C22C38/46 ,  C22C38/44 ,  C22C38/42 ,  C22C38/06 ,  C22C38/04 ,  C22C38/02 ,  C22C38/00 ,  B22F3/16 ,  B22F1/10

CPC classification number: C22C33/02 ,  C22C38/58 ,  C22C38/56 ,  C22C38/50 ,  C22C38/48 ,  C22C38/46 ,  C22C38/44 ,  C22C38/42 ,  C22C38/06 ,  C22C38/04 ,  C22C38/02 ,  C22C38/005 ,  C22C38/002 ,  B22F3/16 ,  B22F1/10 ,  B22F2003/248

Abstract: This application provides Fe—Mn—Al—C lightweight steel, including: Fe, wherein a weight percentage of the Fe is greater than or equal to 50.4 wt %; Mn, wherein a weight percentage of the Mn is 25-35 wt %; Al, wherein a weight percentage of the Al is 6-12 wt %; C, wherein a weight percentage of the C is 0.8-2.0 wt %; and O, wherein a weight percentage of the O is 0.005-0.6 wt %. This application further provides a terminal to which the Fe—Mn—Al—C lightweight steel is applied, a production method for the Fe—Mn—Al—C lightweight steel, a steel mechanical part, and an electronic device. The lightweight steel in this application has low density, high strength, and high elongation.

公开(公告)号：US11567382B2

公开(公告)日：2023-01-31

申请号：US17477686

申请日：2021-09-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhongzhi Tang ,  Zhen He ,  Ming Cai ,  Heshuai Si ,  Banghong Hu

IPC: G02F1/137 ,  G02F1/1333 ,  G02F1/155 ,  G02F1/163

Abstract: A terminal is provided, and the terminal includes a housing, a front screen, a circuit board, and a power supply. The front screen is disposed on the housing, both the circuit board and the power supply are disposed inside the housing, and the power supply is connected to the circuit board. The front screen includes a toughened glass, a color changing layer, and a display screen that are sequentially stacked. The color changing layer is connected to the circuit board, and can change a color when receiving power supply. The color changing layer is disposed in the front screen, and may change a color when receiving the power supply from the circuit board. The color changing layer is configured to change only a color and cannot display a complex image, and power consumption of the color changing layer is far less than that of the display screen.