公开(公告)号：US20230300970A1

公开(公告)日：2023-09-21

申请号：US18324439

申请日：2023-05-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dongming Yu ,  Zhenming Hu ,  Peihua Cui ,  Lei Xiang

IPC: H05K1/02 ,  H05K7/12 ,  H05K7/20 ,  B60R16/023 ,  H05K1/18

CPC classification number: H05K1/0203 ,  B60R16/023 ,  H05K1/181 ,  H05K7/12 ,  H05K7/2039 ,  H05K2201/06

Abstract: An electronic device includes a housing assembly, a circuit board, an electronic component, and a floating support assembly that are assembled together. Installation space is formed in the housing assembly. The circuit board, the electronic component, and the floating support assembly are all accommodated in the installation space. The circuit board is installed in the housing assembly. The electronic component is supported by the circuit board and is in signal communication with the circuit board. The floating support assembly is disposed on the circuit board to support the electronic component or disposed in the housing assembly to support the circuit board, so that the electronic component abuts against the housing assembly under an action of a pre-loading force of the floating support assembly.