公开(公告)号：US20220223989A1

公开(公告)日：2022-07-14

申请号：US17709085

申请日：2022-03-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dongchun QIAO ,  Fanghai XU ,  Jing SHI ,  Xiaoliang DU

IPC: H01P1/20 ,  H01P1/205 ,  H01P1/208

Abstract: Embodiments of this application provide a dielectric filter and a communication device. The dielectric filter includes: a dielectric body, a first blind via and a second blind via that are provided in the dielectric body, a through hole located between the first blind via and the second blind via, and an insulating portion, where inner walls of the first blind via, the second blind via, and the through hole each are covered with a metal layer, and an outer surface of the dielectric body is covered with a metal layer; and the insulating portion is implemented by not covering a metal layer on a surface of the dielectric body, and the insulating portion partially surrounds the through hole.