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1.发明申请公开(公告)号：US20240399711A1
公开(公告)日：2024-12-05
申请号：US18691345
申请日：2022-09-08
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhenmin Xiong , Shijun Zhang , Heng Li , Wei Tang
IPC: B32B15/04 , B23K20/10 , B23K101/36 , B32B3/26
Abstract: This application discloses a magnesium alloy connection mechanical part, an electronic device, and a component forming method. A magnesium alloy body and a conducting layer, and a transition layer that can conduct electricity is formed in a region in which the magnesium alloy body is connected to the conducting layer, and an electrical connection between the magnesium alloy body and the conducting layer is implemented by using the transition layer. The magnesium alloy body and the conducting layer are separated by using the transition layer. In addition, the magnesium alloy body is isolated from the outside by using the conducting layer, a sealing material, and the transition layer, to avoid oxidation or corrosion of the magnesium alloy body, and further avoid galvanic corrosion between structures in the magnesium alloy connection mechanical part.
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公开(公告)号：US20220077123A1
公开(公告)日：2022-03-10
申请号：US17531133
申请日：2021-11-19
Applicant: Huawei Technologies Co., Ltd.
Inventor： Tonglong Zhang , Xiaodong Zhang , Yong Guan , Heng Li
Abstract: A chip package structure includes a first chip, a second chip, and a carrier board. The first chip is disposed between the second chip and the carrier board. An active layer of the first chip is opposite to an active layer of the second chip. A first interconnection structure is disposed between the first chip and the second chip and is configured to couple the active layer of the first chip to the active layer of the second chip. A first conductor pillar is disposed in the first chip. One end of the first conductor pillar is coupled to the active layer of the first chip, and the other end of the first conductor passes through the first chip to be coupled to a circuit in the carrier board.
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