公开(公告)号：US20220320712A1

公开(公告)日：2022-10-06

申请号：US17843582

申请日：2022-06-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lei Lu ,  Jian Liang ,  Xiuyin Zhang ,  Jinxu Xu ,  Huiyang Li ,  Lian Yang ,  Wanli Zhan ,  Zongzhi Gao ,  Weixi Zhou

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q9/04

Abstract: A package antenna apparatus including a package substrate, wherein an antenna array is disposed on the package substrate, and a transceiver chip coupled to the antenna array, where the transceiver chip is fastened to the package substrate, and the transceiver chip has a first pad and a second pad, and a filter disposed on the package substrate, where the filter comprises an input port and an output port, the input port is coupled to the first pad of the transceiver chip, the output port is coupled to the second pad of the transceiver chip, and the filter is configured to filter a signal of the transceiver chip that is input through the input port, and is further configured to output a filtered signal to the transceiver chip through the output port.