Cover and electronic device
    1.
    发明授权

    公开(公告)号:US12244747B2

    公开(公告)日:2025-03-04

    申请号:US17756271

    申请日:2020-11-04

    Abstract: A cover includes a cover body and a first line layer. The cover body is made of an insulating material, and the first line layer is made of a conductive material. The first line layer is completely built into the cover body, and the first line layer is configured to form a radiator, and is coupled to a radio frequency transceiver circuit of an electronic device. The first line layer includes a plurality of first conducting wires and a plurality of second conducting wires. The plurality of first conducting wires are arranged at intervals in a first direction, and the plurality of second conducting wires are arranged at intervals in a second direction. The plurality of first conducting wires and the plurality of second conducting wires are disposed intersecting each other. The first direction is different from the second direction.

    Aluminosilicate glass, chemically strengthened glass, and application

    公开(公告)号:US11591254B2

    公开(公告)日:2023-02-28

    申请号:US16616335

    申请日:2017-05-23

    Abstract: Aluminosilicate glass, chemically strengthened glass, and an application are provided. After the aluminosilicate glass is chemically strengthened, a glass substrate featuring a good mechanical strength and high chemical stability can be obtained, thereby meeting a requirement of cover glass for a glass material. The aluminosilicate glass does not include a B element and a P element, and includes at least silicon oxide, aluminium oxide, alkali metal oxide, and gallium oxide. The alkali metal oxide is at least one of lithium oxide and sodium oxide. The glass is used for production of the cover glass.

    Cover and Electronic Device
    3.
    发明申请

    公开(公告)号:US20220417350A1

    公开(公告)日:2022-12-29

    申请号:US17756271

    申请日:2020-11-04

    Abstract: A cover includes a cover body and a first line layer. The cover body is made of an insulating material, and the first line layer is made of a conductive material. The first line layer is completely built into the cover body, and the first line layer is configured to form a radiator, and is coupled to a radio frequency transceiver circuit of an electronic device. The first line layer includes a plurality of first conducting wires and a plurality of second conducting wires. The plurality of first conducting wires are arranged at intervals in a first direction, and the plurality of second conducting wires are arranged at intervals in a second direction. The plurality of first conducting wires and the plurality of second conducting wires are disposed intersecting each other. The first direction is different from the second direction.

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