公开(公告)号：US20230118584A1

公开(公告)日：2023-04-20

申请号：US17990447

申请日：2022-11-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongtao CUI ,  Yuchan YANG ,  Rong MA ,  Heshuai SI

IPC: H05K5/02 ,  H01Q1/24 ,  H01Q1/00

Abstract: Embodiments of this application provide an enclosure structure, an electronic device, and an enclosure structure preparation method; and relate to the field of electronic device technologies. The enclosure structure includes an enclosure and an antenna grain line. At least a part of the enclosure is made of a non-metal material to form a non-metal part, the non-metal part has a first surface and a second surface that are opposite to each other, the first surface faces an exterior of the electronic device, and the second surface faces an interior of the electronic device. The antenna grain line is disposed on the first surface; or a groove is disposed on the second surface, and the antenna grain line is disposed in the groove.

公开(公告)号：US20190264318A1

公开(公告)日：2019-08-29

申请号：US16411738

申请日：2019-05-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Youhe KE ,  Yongxiang WANG ,  Ming CAI ,  Rong MA

IPC: C23C14/16 ,  C23C14/02 ,  C23C24/00 ,  C23C4/02 ,  C23C4/08

Abstract: Example metal enclosure and metal enclosure manufacturing methods are described. In one example metal enclosure manufacturing method, a thin metal layer is deposited in an electrical connection contact region on a housing of a metal enclosure. Abrasion resistance and corrosion resistance of the thin metal layer are better than those of a metal base material used for the housing. In an example using process, the thin metal layer is exposed on the electrical connection contact.