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公开(公告)号:US20220087073A1
公开(公告)日:2022-03-17
申请号:US17536672
申请日:2021-11-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Longyu LI , Ming CAI , Xuelong HUANG
IPC: H05K7/20
Abstract: A heat conducting part is provided. The heat conducting part includes a shell, including an inner layer and an outer layer, where a cavity is enclosed by the inner layer, and the outer layer wraps a periphery of the inner layer; a capillary structure, disposed in the cavity and abutting against the shell; and cooling liquid, located in the cavity, where the inner layer and the outer layer are made of different materials, and a material density of the outer layer is lower than a material density of the inner layer. In the heat conducting part provided in this application, a material with a relatively large density and a stable chemical property may be selected for the inner layer to ensure durability of the heat conducting part.
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公开(公告)号:US20220004034A1
公开(公告)日:2022-01-06
申请号:US17477686
申请日:2021-09-17
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Zhongzhi TANG , Zhen HE , Ming CAI , Heshuai SI , Banghong HU
IPC: G02F1/137 , G02F1/155 , G02F1/1343 , G02F1/1333 , G06F3/041
Abstract: A terminal is provided, and the terminal includes a housing, a front screen, a circuit board, and a power supply. The front screen is disposed on the housing, both the circuit board and the power supply are disposed inside the housing, and the power supply is connected to the circuit board. The front screen includes a toughened glass, a color changing layer, and a display screen that are sequentially stacked. The color changing layer is connected to the circuit board, and can change a color when receiving power supply. The color changing layer is disposed in the front screen, and may change a color when receiving the power supply from the circuit board. The color changing layer is configured only to change a color and cannot display a complex image, and power consumption of the color changing layer is far less than that of the display screen.
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3.
公开(公告)号:US20240200174A1
公开(公告)日:2024-06-20
申请号:US18587584
申请日:2024-02-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Longyu LI , Ming CAI , Xiaoming XU
IPC: C22C30/00
CPC classification number: C22C30/00
Abstract: This application relates to lightweight steels, preparation methods thereof, and steel structural parts and electronic devices that use the lightweight steel. An example light weight steal includes: Fe, in a percentage by weight greater than or equal to 48.18 wt %; Mn, in a percentage by weight of 30.01 wt % to 35.01 wt %; Al, in a percentage by weight of 12.01 wt % to 15.01 wt %; C, in a percentage by weight of 1.0 wt % to 1.5 wt %; and O, in a percentage by weight of 0.03 wt % to 0.3 wt %. This application further provides a steel structural part, an electronic device that use the lightweight steel, and a preparation method of the lightweight steel.
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公开(公告)号:US20190264318A1
公开(公告)日:2019-08-29
申请号:US16411738
申请日:2019-05-14
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Youhe KE , Yongxiang WANG , Ming CAI , Rong MA
Abstract: Example metal enclosure and metal enclosure manufacturing methods are described. In one example metal enclosure manufacturing method, a thin metal layer is deposited in an electrical connection contact region on a housing of a metal enclosure. Abrasion resistance and corrosion resistance of the thin metal layer are better than those of a metal base material used for the housing. In an example using process, the thin metal layer is exposed on the electrical connection contact.
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公开(公告)号:US20180255664A1
公开(公告)日:2018-09-06
申请号:US15971914
申请日:2018-05-04
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Ming CAI , Banghong HU , Longyu LI
CPC classification number: H05K7/20509 , G06F1/1656 , G06F1/203 , H04M1/026 , H05K7/20 , H05K7/20445
Abstract: Embodiments of the present disclosure provide a middle frame member including: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer.
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6.
公开(公告)号:US20240200178A1
公开(公告)日:2024-06-20
申请号:US18587723
申请日:2024-02-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Xiaoming XU , Ming CAI , Longyu LI
CPC classification number: C22C38/52 , C22C33/0207 , C22C38/44 , C22C38/48
Abstract: The present disclosure relates to a steel, a steel structural part, an electronic device, and a steel structural part preparation method. An example steel includes Fe with a weight percentage of ≥60.67 wt %, Cr with a weight percentage of 8.01 wt % to 8.99 wt %, Ni with a weight percentage of 6 wt % to 7 wt %, Co with a weight percentage of 15.01 wt % to 15.99 wt %, Mo with a weight percentage of 5.5 wt % to 6.5 wt %, Nb with a weight percentage of ≤0.5 wt %, O with a weight percentage of ≤0.3 wt %, and C with a weight percentage of ≤0.05 wt %.
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7.
公开(公告)号:US20230202139A1
公开(公告)日:2023-06-29
申请号:US18173881
申请日:2023-02-24
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Ming CAI
CPC classification number: B32B15/011 , B32B15/20 , B32B7/12 , B32B15/18 , B32B37/1284 , B32B2264/108 , B32B2305/30 , B32B2307/54 , B32B2457/00
Abstract: Embodiments of this application provide an electronic device, a rotating shaft, a laminated composite material, and a method for manufacturing a laminated composite material. The laminated composite material includes at least two material layers that are laminated, and the at least two material layers include a first material layer and a second material layer adjacent to each other. The first material layer uses a first metal material, yield strength of the first metal material is greater than 200 Mpa, and an elongation rate of the first metal material is greater than 6%. The second material layer uses a first composite material, and the first composite material includes a second metal material and diamond particles. In this way, heat conduction performance and heat dissipation performance of the rotating shaft are improved while fracture-resistant performance and wear-resistant performance of the rotating shaft are ensured, thereby improving user experience.
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