公开(公告)号：US20190181108A1

公开(公告)日：2019-06-13

申请号：US16279435

申请日：2019-02-19

Applicant: Huawei Technologies Co., Ltd.

Inventor： Cheng Ting Chen ,  Sheng Chieh Chang ,  Yu Xia

IPC: H01L23/00

Abstract: A semiconductor package structure includes a connection pad disposed on a semiconductor component. A protective layer includes a first non-conductive material, a first part, and a second part. The first part covers the semiconductor component except the connection pad, a surface of the first part is at a first height, the second part covers a periphery of the connection pad, a surface of the second part is at a second height, the first height is less than the second height, a middle part of the connection pad is exposed, and the first part and the second part are connected at an edge of the connection pad.