公开(公告)号：US20230223389A1

公开(公告)日：2023-07-13

申请号：US18175227

申请日：2023-02-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shengli Zhang ,  Fusheng Tang ,  Siqi Wang

IPC: H01L25/16 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14

CPC classification number: H01L25/167 ,  H01L23/5385 ,  H05K1/028 ,  H05K1/147 ,  H05K1/0306 ,  H05K1/0313 ,  H01L24/16 ,  H01L2224/16225

Abstract: An optoelectronic apparatus (200) and an optoelectronic integration method are disclosed, so that bandwidth for signal transmission can be improved, and signal transmission performance is improved. The optoelectronic apparatus (200) includes: a printed circuit board PCB (201), where a first substrate (203) and a second substrate (205) are separately disposed on the PCB (201), an application specific integrated circuit ASIC (202) is disposed on the first substrate (203), and an optoelectronic component (204) is disposed on the second substrate (205); and a flexible printed circuit FPC (206), where a first end of the FPC (206) is disposed on an upper surface of the first substrate (203) and is electrically connected to the ASIC (202), and a second end of the FPC (206) is disposed on the second substrate (205) and is electrically connected to the optoelectronic component (204).