公开(公告)号：US20220394853A1

公开(公告)日：2022-12-08

申请号：US17787212

申请日：2020-10-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Tianqi Hu ,  Yu Chen

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

Abstract: A circuit board assembly and electronic device are provided that improve the reliability of the connection between circuit boards and electronic components. The circuit board assembly includes a first circuit board, including a first side surface and a first sidewall pad, where the first sidewall pad is disposed on the first side surface, a second circuit board, fastened to the first circuit board, where the first sidewall pad is located at a position close to the second circuit board, and sidewall solder, adhered to the first sidewall pad and the second circuit board.