公开(公告)号：US20230363087A1

公开(公告)日：2023-11-09

申请号：US18246036

申请日：2021-09-07

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin Shi ,  Xin Guo ,  Lixiang Wang ,  Haisheng Tu ,  Benyin Zheng

IPC: H05K1/02 ,  H05K1/14 ,  H05K5/03

CPC classification number: H05K1/0298 ,  H05K1/144 ,  H05K5/03

Abstract: This application provides a printed circuit board assembly and an electronic device. The printed circuit board assembly includes: a printed circuit board, where the printed circuit board includes a functional network, and the functional network is configured to provide an electrical function; a conductive part, where the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network; and a cover-shaped structure, where the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure. The foregoing technical solutions can reduce impedance of a circuit board, improve a current utilization, and further improve mechanical reliability of the circuit board.

公开(公告)号：US11367700B2

公开(公告)日：2022-06-21

申请号：US16958565

申请日：2017-12-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin Shi ,  Zhuqiu Wang ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.

公开(公告)号：US20190311996A1

公开(公告)日：2019-10-10

申请号：US16339195

申请日：2017-03-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L23/498

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

公开(公告)号：US20220394853A1

公开(公告)日：2022-12-08

申请号：US17787212

申请日：2020-10-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Tianqi Hu ,  Yu Chen

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

Abstract: A circuit board assembly and electronic device are provided that improve the reliability of the connection between circuit boards and electronic components. The circuit board assembly includes a first circuit board, including a first side surface and a first sidewall pad, where the first sidewall pad is disposed on the first side surface, a second circuit board, fastened to the first circuit board, where the first sidewall pad is located at a position close to the second circuit board, and sidewall solder, adhered to the first sidewall pad and the second circuit board.

公开(公告)号：US11011477B2

公开(公告)日：2021-05-18

申请号：US16339195

申请日：2017-03-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/488 ,  H01L25/00 ,  B32B27/38

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.