公开(公告)号：US20250056744A1

公开(公告)日：2025-02-13

申请号：US18930135

申请日：2024-10-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xutong Yang ,  Tianyi Xing ,  Chong Xing

IPC: H05K5/02 ,  C25D3/02 ,  C25D5/00 ,  H01M50/247 ,  H05K5/03

Abstract: A housing assembly includes a substrate, where the substrate includes a first surface and a second surface that are opposite to each other, the first surface of the substrate is close to an electronic device, and the substrate is formed through hot-pressing after glass fiber cloth is soaked in an epoxy resin adhesive solution; a first decoration layer, disposed on the first surface of the substrate; a light shielding layer, disposed on a surface that is of the first decoration layer and that is away from the substrate; and a second decoration layer, disposed on the second surface of the substrate. Therefore, the substrate uses a glass fiber epoxy resin plate, which is a light and thin material, and is high in strength, modulus, and transparency.