公开(公告)号：US20210013154A1

公开(公告)日：2021-01-14

申请号：US17038756

申请日：2020-09-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wei Wu ,  Ding Li ,  Hongcheng Yin ,  Xiongcai Kuang

IPC: H01L23/552 ,  H01L23/00

Abstract: A flip-chip die package includes a substrate, a die, a plurality of conductive bumps, and a first metal structure, where an upper surface of the die is electrically coupled, using the conductive bumps, to a surface that is of the substrate and that faces the die, and the first metal structure includes a plurality of first metal rods disposed between the substrate and the die, where each first metal rod is electrically coupled to the substrate and the die, and the first metal rods are arranged around a first active functional circuit, and the first active functional circuit includes an electromagnetic radiation capability or an electromagnetic receiving capability in the die.

公开(公告)号：US11251136B2

公开(公告)日：2022-02-15

申请号：US17038756

申请日：2020-09-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wei Wu ,  Ding Li ,  Hongcheng Yin ,  Xiongcai Kuang

IPC: H01L23/552 ,  H01L23/00

Abstract: A flip-chip die package includes a substrate, a die, a plurality of conductive bumps, and a first metal structure, where an upper surface of the die is electrically coupled, using the conductive bumps, to a surface that is of the substrate and that faces the die, and the first metal structure includes a plurality of first metal rods disposed between the substrate and the die, where each first metal rod is electrically coupled to the substrate and the die, and the first metal rods are arranged around a first active functional circuit, and the first active functional circuit includes an electromagnetic radiation capability or an electromagnetic receiving capability in the die.