公开(公告)号：US20230352334A1

公开(公告)日：2023-11-02

申请号：US18006066

申请日：2021-07-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Shanshan Wei ,  Yong She ,  Jianping Fang

IPC: H01L21/683 ,  H01L25/075

CPC classification number: H01L21/6835 ,  H01L25/0753 ,  H01L2221/68368

Abstract: A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.