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公开(公告)号:US20240313388A1
公开(公告)日:2024-09-19
申请号:US18575631
申请日:2022-06-28
Applicant: Huawei Technologies Co., Ltd.
Inventor: Yu Yao , Youquan Wu , Meng Hou
CPC classification number: H01Q1/2283 , H01L23/66 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01L2223/6677
Abstract: A chip having an antenna structure comprising a ground layer, a feeding element, and an antenna element. The antenna element comprises a first metal layer, a second metal layer, a first conducting member, and a second conducting member, the first metal layer and the ground layer are disposed opposite and spaced from each other, the second metal layer is located between the first metal layer and the ground layer and is spaced from both the first metal layer and the ground layer, the second metal layer comprises a first area and a second area that are spaced from each other, the first conducting member is connected between the first metal layer and the first area of the second metal layer, and the second conducting member is connected between the ground layer and the second area of the second metal layer.
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公开(公告)号:US20240304999A1
公开(公告)日:2024-09-12
申请号:US18547779
申请日:2022-02-25
Applicant: Huawei Technologies Co., Ltd.
Inventor: Naida Zhu , Meng Hou , Youquan Wu
CPC classification number: H01Q9/0457 , H01Q1/22 , H01Q5/385 , H01Q13/18
Abstract: A millimeter wave antenna includes a first metal plate, a second metal plate, and a radiation patch that are arranged in a stack manner. The first metal plate and the second metal plate form a cavity, and a first feeder is disposed in the cavity to feed the cavity. The second metal plate has a first slot. The radiation patch includes at least two patch elements, and a first patch slot is formed between the at least two patch elements. The first slot feeds the radiation patch.
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