公开(公告)号：US20240260226A1

公开(公告)日：2024-08-01

申请号：US18628991

申请日：2024-04-08

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yunchao HAN ,  Bo ZHAO ,  Weifeng HU

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/20145

Abstract: A cabinet is provided. The cabinet includes a housing, a heat generation device and a heat exchanger that are located in the housing and arranged along a first direction. The heat generation device has a device cavity, and the heat exchanger has a heat exchanger cavity. Along a second direction, an air-in cavity and an air-out cavity are respectively provided between two ends of the heat generation device and the housing (1). Along a third direction, a first cavity and a second cavity are respectively provided between two ends of the heat generation device and the housing. A third cavity and a fourth cavity are respectively provided between two ends of the heat exchanger and the housing. Airflow can flow through the device cavity, the air-out cavity, the first cavity, the third cavity, the heat exchanger cavity, and the fourth cavity, and enter the air-in cavity from the fourth cavity.

公开(公告)号：US20220357537A1

公开(公告)日：2022-11-10

申请号：US17813874

申请日：2022-07-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yunchao HAN ,  Dongjie AI ,  Jing WANG

IPC: G02B6/42

Abstract: This application provides a heat dissipation structure for an optical module and a communications device, and relates to the field of optical communications technologies. The heat dissipation structure for the optical module includes: a panel with a jack; a PCB board, disposed on one side of the panel, where the PCB board is configured to install the optical module; and a heat conduction module, configured to conduct, to the panel, heat emitted from the optical module, where one end of the heat conduction module is in contact with the optical module, and the other end of the heat conduction module is in contact with the panel. In the heat dissipation structure for the optical module and the communications device, the panel is mainly used to dissipate heat from the optical module.