公开(公告)号：US09307671B2

公开(公告)日：2016-04-05

申请号：US13964948

申请日：2013-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shuliang Huang ,  Zhaoxia Luo ,  Youhe Ke

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20 ,  H05K7/20727

Abstract: Embodiments of the present invention relate to a board cooling apparatus comprising a shell and a board, where the board and an interior wall of the shell form a closed space, a cooling medium inlet and a cooling medium outlet are disposed on the shell, a separator plate that separates the board into a first part and a second part, a through opening between the first part and the second part, a cooling medium flows into the first part from the cooling medium inlet and then flows into the second part, and flows out from the cooling medium outlet, a flow guiding mechanism that is disposed on the board and configured to divert the cooling medium flowing into the first part from the cooling medium inlet, so as to directly guide part of the cooling medium into the second part.

Abstract translation: 本发明的实施例涉及一种包括壳体和板的板冷却装置，其中板和壳体的内壁形成封闭空间，冷却介质入口和冷却介质出口设置在壳体上，分离器 板将板分成第一部分和第二部分，第一部分和第二部分之间的通孔，冷却介质从冷却介质入口流入第一部分，然后流入第二部分，并流出 从所述冷却介质出口排出的流动引导机构，所述流动引导机构设置在所述板上并且构造成将从所述冷却介质入口流入所述第一部分的冷却介质转向，以将所述冷却介质的一部分直接引导到所述第二部分。

公开(公告)号：US20130329362A1

公开(公告)日：2013-12-12

申请号：US13964948

申请日：2013-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shuliang Huang ,  Zhaoxia Luo ,  Youhe Ke

IPC: H05K7/20

CPC classification number: H05K7/20 ,  H05K7/20727

Abstract: Embodiments of the present invention relate to a board cooling apparatus comprising a shell and a board, where the board and an interior wall of the shell form a closed space, a cooling medium inlet and a cooling medium outlet are disposed on the shell, a separator plate that separates the board into a first part and a second part, a through opening between the first part and the second part, a cooling medium flows into the first part from the cooling medium inlet and then flows into the second part, and flows out from the cooling medium outlet, a flow guiding mechanism that is disposed on the board and configured to divert the cooling medium flowing into the first part from the cooling medium inlet, so as to directly guide part of the cooling medium into the second part.

Abstract translation: 本发明的实施例涉及一种包括壳体和板的板冷却装置，其中板和壳体的内壁形成封闭空间，冷却介质入口和冷却介质出口设置在壳体上，分离器 板将板分成第一部分和第二部分，第一部分和第二部分之间的通孔，冷却介质从冷却介质入口流入第一部分，然后流入第二部分，并流出 从所述冷却介质出口排出的流动引导机构，所述流动引导机构设置在所述板上并且构造成将从所述冷却介质入口流入所述第一部分的冷却介质转向，以将所述冷却介质的一部分直接引导到所述第二部分。

公开(公告)号：US20140352928A1

公开(公告)日：2014-12-04

申请号：US14462810

申请日：2014-08-19

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shuliang Huang ,  Zhaoxia Luo ,  Youhe Ke

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20772

Abstract: An electronic device and a heat dissipation system and heat dissipation method are provided that can be used in combination with a common heat exchange/refrigerating electronic device, thereby reducing an investment cost. The heat dissipation system of an electronic device includes a cooling pool, a heat exchanger, and at least one circulating pump, where a cooling medium is provided in the cooling pool, and the electronic device and the heat exchanger are immersed in the cooling medium; the circulating pump is configured to drive the cooling medium to circulatively flow between the electronic device and the heat exchanger; and a heat exchange medium is provided in the heat exchanger and used to exchange heat with the cooling medium, and the heat exchange medium flows out of the heat exchanger for cooling and then flows back, so as to discharge heat released by the electronic device.

Abstract translation: 本发明提供一种电子设备和散热系统及散热方法，其可以与普通的热交换/制冷电子设备结合使用，从而降低了投资成本。 电子设备的散热系统包括冷却池，热交换器和至少一个循环泵，其中在冷却池中设置冷却介质，电子设备和热交换器浸入冷却介质中; 循环泵构造成驱动冷却介质循环地在电子设备和热交换器之间流动; 并且在热交换器中设置有热交换介质，用于与冷却介质进行热交换，并且热交换介质流出热交换器进行冷却，然后流回，从而排出由电子设备释放的热量。

公开(公告)号：US20140071625A1

公开(公告)日：2014-03-13

申请号：US14081654

申请日：2013-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhaoxia Luo ,  Shuliang Huang ,  Youhe Ke ,  Liqian Zhai

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20272

Abstract: Embodiments of the present invention provide an immersion cooling system, including: an electronic device, a non-conductive working medium, and one or more gasbags. The electronic device is immersed in the non-conductive working medium; the non-conductive working medium is configured to dissipate heat for the electronic device, and a volume of the non-conductive working medium expands as a temperature rises; and a surface of the gasbag is elastic, and the gasbag is configured to reduce its volume when the gasbag is compressed by volume expansion of the non-conductive working medium, so as to buffer a pressure rise in the system, where the pressure rise is caused by the volume expansion of the non-conductive working medium. With the immersion cooling system provided in the embodiments of the present invention, installation is more flexible and cooling performance of the system is further improved.

Abstract translation: 本发明的实施例提供了一种浸没冷却系统，包括：电子装置，非导电工作介质和一个或多个气囊。 电子器件浸没在非导电工作介质中; 非导电工作介质被配置为耗散用于电子设备的热量，并且一部分非导电工作介质的体积随温度升高而膨胀; 并且所述气囊的表面是弹性的，并且所述气囊被构造成当所述气囊被所述非导电工作介质的体积膨胀压缩时减小其体积，以缓冲所述系统中的压力升高，其中所述压力升高为 这是由非导电工作介质的体积膨胀引起的。 利用在本发明的实施例中提供的浸入式冷却系统，安装更加灵活，进一步提高了系统的冷却性能。