公开(公告)号：US11265265B2

公开(公告)日：2022-03-01

申请号：US17035455

申请日：2020-09-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Anxue Du ,  Lianqiang Wang ,  Chong Chen

IPC: H04L12/28 ,  H04L49/15 ,  H04L49/10 ,  H04L49/45

Abstract: This application provides a data communications system and method. The system includes a first chassis and a second chassis. The first chassis includes a first high-performance switching module and a first low-performance switching module. The second chassis includes a second high-performance switching module and a second low-performance switching module. The first high-performance switching module is connected to the second low-performance switching module. The first low-performance switching module is connected to the second high-performance switching module. The first high-performance switching module is configured to connect to a third low-performance switching module in a third chassis that is to be added to the communications system. The second high-performance switching module is configured to connect to a fourth low-performance switching module in the third chassis that is to be added to the communications system. During capacity expansion, there is no need to change cables between deployed chassis.

公开(公告)号：US20250016116A1

公开(公告)日：2025-01-09

申请号：US18895003

申请日：2024-09-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： Fujiang Wang ,  Lianqiang Wang ,  Anxue Du

IPC: H04L49/10 ,  H04L49/351

Abstract: This application discloses a switching fabric board, a data forwarding method, a switching subrack, and a network system, and belongs to the communication field. The switching fabric board is a first switching fabric board connected to a first network device. The first switching fabric board includes a first connector and a first communication module. The first connector is connected to the first communication module based on a first signal cable. The first communication module is further configured to connect to a second communication module, the second communication module is connected to a first switching chip, the first switching chip has a data forwarding capability, and the second communication module and the first switching chip are configured on a second switching fabric board connected to a second network device.

公开(公告)号：US20240260218A1

公开(公告)日：2024-08-01

申请号：US18614134

申请日：2024-03-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jinhua Ye ,  Lianqiang Wang ,  Jilong Ye

IPC: H05K7/14 ,  H05K7/10

CPC classification number: H05K7/1422 ,  H05K7/10

Abstract: This application provides an orthogonal system architecture and a network device. The orthogonal system architecture includes a first circuit board, a second circuit board, a first connector, and a second connector. The first circuit board and the second circuit board are disposed vertically to each other. The first connector is electrically connected to the first circuit board via a first cable assembly, the second connector is disposed on the second circuit board and is electrically connected to the second circuit board, and the first connector is plug-connected to the second connector, to electrically connect the first circuit board to the second circuit board. When the foregoing structure is used, the first circuit board is electrically connected to the first connector via the first cable assembly.

公开(公告)号：US20230280553A1

公开(公告)日：2023-09-07

申请号：US18316770

申请日：2023-05-12

Applicant: Huawei Technologies Co.,Ltd.

Inventor： Cheng Li ,  Lianqiang Wang ,  Yong Yang ,  Yongtao He ,  Zhengtao Zhang

IPC: G02B6/42 ,  H05K7/20

CPC classification number: G02B6/4268 ,  H05K7/20772 ,  H05K7/20263

Abstract: In accordance with an embodiment, a pluggable device includes: a housing; a circuit board; a heat emitting element; and a liquid cooling part comprising two pipe joints fastened to a housing wall of the housing. The two pipe joints are configured to be respectively connected to a liquid discharge pipe joint and a liquid inlet pipe joint of a liquid cooling heat dissipation part, and the circuit board, the heat emitting element, and the liquid cooling part are sequentially stacked in the housing.