公开(公告)号：US20120308037A1

公开(公告)日：2012-12-06

申请号：US13153074

申请日：2011-06-03

申请人： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Ming-Li Hsu ,  Xian-Gen Liao

发明人： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Ming-Li Hsu ,  Xian-Gen Liao

IPC分类号： H04R3/00 ,  H04R31/00

CPC分类号： H04R19/005 ,  Y10T29/49005

摘要： A microelectromechanical microphone chip having a stereoscopic diaphragm structure includes a base, having a chamber; a diaphragm, disposed on the chamber and having steps with height differences; and a back plate, disposed on the diaphragm, forming a space with the diaphragm in between, and having a plurality of sound-holes communicating with the space.

摘要翻译： 具有立体光阑结构的微电机麦克风芯片包括具有腔室的底座; 隔膜，设置在室上并具有高度差的台阶; 以及设置在所述隔膜上的后板，在所述隔膜之间形成有与所述隔膜连通的多个声孔的空间。

公开(公告)号：US08687827B2

公开(公告)日：2014-04-01

申请号：US13482350

申请日：2012-05-29

申请人： Hung-Jen Chen ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Ming-Li Hsu

发明人： Hung-Jen Chen ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Ming-Li Hsu

IPC分类号： H04R25/00 ,  H01L29/84

CPC分类号： H04R19/04 ,  H04R19/005 ,  H04R31/00

摘要： A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

摘要翻译： 具有扩展后室的MEMS麦克风芯片包括第一芯片单元和第二芯片单元。 第一芯片单元具有第一基板，在第一基板的端部的上方形成振动膜层，在第一基板的振动膜层的下方形成有空间，使得振动膜层悬挂在第一基板的上方 振动 第二芯片单元具有与第一基板的另一端连接的第二基板，并且在第二基板中形成宽度大于该空间的宽度的槽; 当第一基板和第二基板联接在一起时，槽和空间连接在一起以用作振动膜层的后室。

公开(公告)号：US20130101143A1

公开(公告)日：2013-04-25

申请号：US13278558

申请日：2011-10-21

申请人： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Ming-Li Hsu

发明人： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Ming-Li Hsu

IPC分类号： H04R1/00

CPC分类号： H04R31/006 ,  H04R1/2807 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/03

摘要： A MEMS microphone chip with an expanded chamber comprises a base plate, and the base plate has a main chamber and a secondary chamber. The secondary chamber is formed beside the main chamber, and is connected to the main chamber. A vibration membrane is suspended above the main chamber for receiving external sound waves, and the vibration membrane vibrates in corresponding to the chambers. The MEMS microphone chip has a higher sensitivity because of the expanded chamber, and therefore has a more ideal audio frequency response curve.

摘要翻译： 具有扩展室的MEMS麦克风芯片包括基板，并且基板具有主室和次室。 副室形成在主室旁边，并连接到主室。 振动膜悬挂在主室上方，用于接收外部声波，振动膜相应于腔室振动。 由于扩大的腔室，MEMS麦克风芯片具有更高的灵敏度，因此具有更理想的音频响应曲线。