专利检索 ap:("Huntsman Advanced Materials Licensing (Switzerland) GmbH") AND inv:"Kenneth Black SCOBBIE" 第 1 页

1.

发明公开
LOW DIELECTRIC RESIN COMPOSITION AND AN ARTICLE OF MANUFACTURE PREPARED THEREFROM 审中-公开

公开(公告)号：US20240182613A1

公开(公告)日：2024-06-06

申请号：US18283831

申请日：2022-03-30

申请人： Huntsman Advanced Materials Licensing (Switzerland) GmbH

发明人： Christof STORZ , Kenneth Black SCOBBIE , Susanne ELMER , Michael Yin WONG , Alessandro NAPOLI

IPC分类号： C08F212/32 , C08F283/06 , C08J5/24 , C08L71/12

CPC分类号： C08F212/32 , C08F283/06 , C08J5/249 , C08L71/126 , C08J2471/12

摘要： The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.