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公开(公告)号:US09576916B2
公开(公告)日:2017-02-21
申请号:US13543050
申请日:2012-07-06
申请人: Hyeon-jin Shin , Jae-young Choi , Seong-chan Jun , Whan-kyun Kim , Hyung-seo Yoon , Ju-yeong Oh , Ju-hwan Lim
发明人: Hyeon-jin Shin , Jae-young Choi , Seong-chan Jun , Whan-kyun Kim , Hyung-seo Yoon , Ju-yeong Oh , Ju-hwan Lim
IPC分类号: H01L23/66 , H01L23/532 , H01L27/04
CPC分类号: H01L23/66 , H01L23/53276 , H01L27/04 , H01L2223/6627 , H01L2924/0002 , H01L2924/00
摘要: A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit, where at least one of a trench and a via is defined under the graphene interconnection unit.
摘要翻译: 高频电路包括第一电子器件,第二电子器件和石墨烯互连单元,其中沟槽和通孔中的至少一个限定在石墨烯互连单元下方。