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公开(公告)号：US20230020477A1
公开(公告)日：2023-01-19
申请号：US17810994
申请日：2022-07-06
发明人： Jin Young Yoon , Hee Joon Lee , Dong Eun Cha , Sun Jun Kwon , Chun Ho Park , Seung Ryong Jeong , Jeong Gil Ko , Yoon Hwan Lee
摘要： The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction of 96% or more as measured by 13C-NMR, a thermoplastic elastomer, an inorganic filler having an average particle diameter of 0.1 μm to 5 μm, and a compatibilizer, and has a flexural modulus of 2,500 MPa or more and a coefficient of linear thermal expansion of 60 μm/m·° C. or less.
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公开(公告)号：US11905402B2
公开(公告)日：2024-02-20
申请号：US17810994
申请日：2022-07-06
发明人： Jin Young Yoon , Hee Joon Lee , Dong Eun Cha , Sun Jun Kwon , Chun Ho Park , Seung Ryong Jeong , Jeong Gil Ko , Yoon Hwan Lee
CPC分类号： C08L23/16 , C08L23/12 , C08L2205/08 , C08L2207/04
摘要： The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction of 96% or more as measured by 13C-NMR, a thermoplastic elastomer, an inorganic filler having an average particle diameter of 0.1 μm to 5 μm, and a compatibilizer, and has a flexural modulus of 2,500 MPa or more and a coefficient of linear thermal expansion of 60 μm/m·° C. or less.
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