Isolation structure, semiconductor device having the same, and method for fabricating the isolation structure
    1.
    发明授权
    Isolation structure, semiconductor device having the same, and method for fabricating the isolation structure 有权
    隔离结构,具有相同的半导体器件,以及用于制造隔离结构的方法

    公开(公告)号:US09105684B2

    公开(公告)日:2015-08-11

    申请号:US13465593

    申请日:2012-05-07

    摘要: An isolation structure of a semiconductor, a semiconductor device having the same, and a method for fabricating the isolation structure are provided. An isolation structure of a semiconductor device may include a trench formed in a substrate, an oxide layer formed on a bottom surface and an inner sidewall of the trench, a filler formed on the oxide layer to fill a part of inside of the trench, and a fourth oxide layer filling an upper portion of the filler of the trench to a height above an upper surface of the trench, an undercut structure being formed on a boundary area between the inner sidewall and the oxide layer.

    摘要翻译: 提供半导体的隔离结构,具有该隔离结构的半导体器件以及用于制造隔离结构的方法。 半导体器件的隔离结构可以包括形成在衬底中的沟槽,形成在沟槽的底表面和内侧壁上的氧化物层,形成在氧化物层上以填充沟槽内部的一部分的填充物,以及 将沟槽的填料的上部填充到沟槽的上表面上方的高度的第四氧化物层,在内侧壁和氧化物层之间的边界区域上形成底切结构。