SEMICONDUCTOR DEVICES HAVING SILICIDE AND METHODS OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICES HAVING SILICIDE AND METHODS OF MANUFACTURING THE SAME 有权
    具有硅氧烷的半导体器件及其制造方法

    公开(公告)号:US20160197074A1

    公开(公告)日:2016-07-07

    申请号:US14969319

    申请日:2015-12-15

    摘要: Semiconductor devices, having dual silicides, include a first fin, having N-type impurities, and a second fin, having P-type impurities, on a substrate. A first gate electrode and a first source/drain area are on the first fin. A second gate electrode and a second source/drain area are on the second fin. An etch stop layer is on the first source/drain area and the second source/drain area. An insulating layer is on the etch stop layer. A first plug connected to the first source/drain area and a second plug connected to the second source/drain area are formed through the insulating layer and the etch stop layer. A first metal silicide layer is in the first source/drain area. A second metal silicide layer having a material different from the first metal silicide layer and having a thickness smaller than the first metal silicide layer is in the second source/drain area.

    摘要翻译: 具有双重硅化物的半导体器件在衬底上包括具有N型杂质的第一鳍片和具有P型杂质的第二鳍片。 第一栅极电极和第一源极/漏极区域在第一鳍片上。 第二栅极电极和第二源极/漏极区域在第二鳍片上。 蚀刻停止层位于第一源极/漏极区域和第二源极/漏极区域上。 绝缘层位于蚀刻停止层上。 连接到第一源极/漏极区域的第一插头和连接到第二源极/漏极区域的第二插头穿过绝缘层和蚀刻停止层。 第一金属硅化物层位于第一源极/漏极区域中。 具有不同于第一金属硅化物层并且具有小于第一金属硅化物层的厚度的材料的第二金属硅化物层位于第二源极/漏极区域中。