公开(公告)号：US10314166B2

公开(公告)日：2019-06-04

申请号：US14996298

申请日：2016-01-15

Applicant: IBIDEN CO., LTD.

Inventor： Nobuhisa Kuroda ,  Hirofumi Futamura

IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538

Abstract: A printed wiring board for mounting a semiconductor element includes an insulating substrate, a first conductor structure on first side of the substrate, and a second conductor structure on second side of the substrate. The substrate has a first area and a second area outside the first area such that when a semiconductor element is mounted on the first side, the first area is directly below the element, the first structure has a first area conductor structure in the first area and a second area conductor structure in the second area, and the first structure is formed such that first ratio is set greater than second ratio, where the first ratio is obtained by dividing volume of the first area structure by area of the first area structure, and the second ratio is obtained by dividing volume of the second area structure by area of the second area structure.