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公开(公告)号：US09743534B2
公开(公告)日：2017-08-22
申请号：US14878072
申请日：2015-10-08
Applicant: IBIDEN CO., LTD.
Inventor： Mitsuhiro Tomikawa , Kota Noda , Nobuhisa Kuroda , Haruhiko Morita
CPC classification number: H05K3/4697 , H01L2224/16227 , H01L2224/16265 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/141 , H05K1/185 , H05K3/0038 , H05K3/427 , H05K3/4602 , H05K3/4644 , H05K2201/10015 , H05K2203/1476 , H01L2924/00014 , H01L2224/32225 , H01L2924/00012
Abstract: A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity.
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公开(公告)号：US09185806B2
公开(公告)日：2015-11-10
申请号：US14041743
申请日：2013-09-30
Applicant: IBIDEN CO., LTD.
Inventor： Fumitaka Takagi , Nobuhisa Kuroda , Mariko Kimura
CPC classification number: H05K1/183 , H01L23/49827 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83411 , H01L2224/83444 , H01L2224/83455 , H01L2224/83464 , H01L2224/92125 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H05K1/181 , H05K3/02 , H05K3/3436 , H05K3/3452 , H05K2201/09845 , H05K2201/10515 , H05K2201/10674 , Y02P70/611 , H01L2924/00012 , H01L2924/00
Abstract: A printed wiring board includes an interlayer resin insulation layer, a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device, and a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of the pad structure from the solder-resist layer. The opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion is exposing an upper surface and a portion of a side surface of the pad structure.
Abstract translation: 印刷布线板包括层间树脂绝缘层，形成在层间树脂绝缘层上并定位成安装半导体器件的焊盘结构，以及形成在层间树脂绝缘层上的阻焊层，并且具有露出部分 的焊料结构。 阻焊层的开口部分具有底表面，使得开口部分的底表面暴露焊盘结构的上表面和侧表面的一部分。
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公开(公告)号：US11222791B2
公开(公告)日：2022-01-11
申请号：US15931696
申请日：2020-05-14
Applicant: IBIDEN CO., LTD.
Inventor： Yoji Sawada , Nobuhisa Kuroda , Kazuyuki Ueda , Shota Tachibana
Abstract: A printed wiring board includes a resin insulating layer, a metal post formed in the resin insulating layer such that the metal post is protruding from a first surface of the resin insulating layer, a conductor layer formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the metal post and the conductor layer. The metal post has a protruding portion protruding from the first surface of the resin insulating layer and an embedded portion integrally formed with the protruding portion and embedded in the resin insulating layer.
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Patent Agency Ranking
公开(公告)号：US10314166B2
公开(公告)日：2019-06-04
申请号：US14996298
申请日：2016-01-15
Applicant: IBIDEN CO., LTD.
Inventor： Nobuhisa Kuroda , Hirofumi Futamura
IPC: H05K1/02 , H01L23/498 , H01L21/48 , H01L23/538
Abstract: A printed wiring board for mounting a semiconductor element includes an insulating substrate, a first conductor structure on first side of the substrate, and a second conductor structure on second side of the substrate. The substrate has a first area and a second area outside the first area such that when a semiconductor element is mounted on the first side, the first area is directly below the element, the first structure has a first area conductor structure in the first area and a second area conductor structure in the second area, and the first structure is formed such that first ratio is set greater than second ratio, where the first ratio is obtained by dividing volume of the first area structure by area of the first area structure, and the second ratio is obtained by dividing volume of the second area structure by area of the second area structure.
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公开(公告)号：US20140090877A1
公开(公告)日：2014-04-03
申请号：US14041743
申请日：2013-09-30
Applicant: IBIDEN CO., LTD.
Inventor： Fumitaka TAKAGI , Nobuhisa Kuroda , Mariko Kimura
CPC classification number: H05K1/183 , H01L23/49827 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83411 , H01L2224/83444 , H01L2224/83455 , H01L2224/83464 , H01L2224/92125 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H05K1/181 , H05K3/02 , H05K3/3436 , H05K3/3452 , H05K2201/09845 , H05K2201/10515 , H05K2201/10674 , Y02P70/611 , H01L2924/00012 , H01L2924/00
Abstract: A printed wiring board includes an interlayer resin insulation layer, a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device, and a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of the pad structure from the solder-resist layer. The opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion is exposing an upper surface and a portion of a side surface of the pad structure.
Abstract translation: 印刷布线板包括层间树脂绝缘层，形成在层间树脂绝缘层上并定位成安装半导体器件的焊盘结构，以及形成在层间树脂绝缘层上的阻焊层，并且具有露出部分 的焊料结构。 阻焊层的开口部分具有底表面，使得开口部分的底表面暴露焊盘结构的上表面和侧表面的一部分。
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公开(公告)号：US11678440B2
公开(公告)日：2023-06-13
申请号：US16874847
申请日：2020-05-15
Applicant: IBIDEN CO., LTD.
Inventor： Yoji Sawada , Nobuhisa Kuroda , Kazuyuki Ueda , Shota Tachibana
CPC classification number: H05K3/4092 , H05K1/115 , H05K3/4061 , H05K1/111 , H05K1/18 , H05K2201/0373
Abstract: A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.
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公开(公告)号：US09930791B2
公开(公告)日：2018-03-27
申请号：US14878096
申请日：2015-10-08
Applicant: IBIDEN CO., LTD.
Inventor： Mitsuhiro Tomikawa , Kota Noda , Nobuhisa Kuroda , Haruhiko Morita
IPC: H05K1/16 , H05K3/46 , H01G4/30 , H01G4/12 , H01G4/232 , H05K1/11 , H05K3/42 , H01L23/31 , H01G2/06
CPC classification number: H05K3/4697 , H01G2/06 , H01G4/12 , H01G4/232 , H01G4/30 , H01L23/3128 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2225/1058 , H01L2924/15331 , H05K1/115 , H05K3/429 , H05K3/4644 , H05K2201/09545 , H05K2201/09827 , H05K2201/10015
Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities.
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公开(公告)号：US09374903B2
公开(公告)日：2016-06-21
申请号：US14210802
申请日：2014-03-14
Applicant: IBIDEN CO., LTD.
Inventor： Naoki Katsuda , Naoto Ishida , Kota Noda , Nobuhisa Kuroda
CPC classification number: H05K1/185 , H05K3/4007 , H05K3/4661 , H05K2201/094
Abstract: A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second laminated structure on second surface of the substrate and including a conductive circuit layer on the second surface of the substrate, a resin insulating layer and the outermost conductive circuit layer. The outermost conductive layer in the first structure has solder pads positioned to mount a semiconductor element and solder bumps formed on the pads, respectively, the outermost conductive layer in the second structure has solder pads positioned to mount a wiring board, and the outermost conductive layers in the first and second structures have thicknesses formed greater than thicknesses of the conductive layers on the surfaces of the substrate.
Abstract translation: 用于安装半导体元件的多层印刷线路板包括芯基板，在基板的第一表面上的第一层叠结构，并且在基板的第一表面上包括导电电路层，树脂绝缘层和最外导体电路层， 以及在所述基板的第二表面上的第二层叠结构，并且在所述基板的第二表面上包括导电电路层，树脂绝缘层和最外面的导电电路层。 第一结构中的最外面的导电层具有分别安装半导体元件和形成在焊盘上的焊锡凸块的焊盘，第二结构中的最外面的导电层具有定位成安装布线板的焊盘，并且最外面的导电层 在第一和第二结构中，厚度大于衬底表面上的导电层的厚度。
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