-
公开(公告)号：US20240206057A1
公开(公告)日：2024-06-20
申请号：US18542813
申请日：2023-12-18
Applicant: IBIDEN CO., LTD.
Inventor： Shunsuke SAKAI , Koji OKABE
CPC classification number: H05K1/0296 , H05K3/067 , H05K3/064
Abstract: A wiring substrate includes a substrate, and a conductor layer formed on the substrate and including copper such that the conductor layer is patterned. The conductor layer is formed such that the upper surface of the conductor layer has a width that is equal to or larger than a width of the lower surface of the conductor layer and that the width of the lower surface is larger than the minimum width of a middle portion of the conductor layer between the upper surface and the lower surface.
Search Results
1
records
(took 0.009 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
