公开(公告)号：US20240349423A1

公开(公告)日：2024-10-17

申请号：US18682745

申请日：2022-05-30

申请人： GUANGZHOU FANGBANG ELECTRONICS CO., LTD

发明人： Meijuan Zhang ,  Yuhua Zhu

IPC分类号： H05K1/09 ,  H05K3/06

CPC分类号： H05K1/09 ,  H05K3/064 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355

摘要： The present disclosure relates to the technical field of metal foils. Disclosed is a metal foil, including a conductive layer and a bearing layer, the conductive layer and the bearing layer being stacked. The conductive layer is configured to manufacture a conductive line. When a circuit board is manufactured using the metal foil, the bearing layer is separated from the conductive layer by a first etching solution, and a roughness Rz of a surface, close to the conductive layer, of the bearing layer is less than or equal to 2 microns. When the circuit board is manufactured using the metal foil, a surface of the conductive line is substantially flush with a surface of a substrate after the bearing layer is removed, and the surface roughness of the conductive line is low, so that the product requirement for high dimensional accuracy may be satisfied. Meanwhile, embodiments of the present disclosure further correspondingly provide a circuit board and a method for manufacturing the circuit board.

公开(公告)号：US20240206057A1

公开(公告)日：2024-06-20

申请号：US18542813

申请日：2023-12-18

申请人： IBIDEN CO., LTD.

发明人： Shunsuke SAKAI ,  Koji OKABE

IPC分类号： H05K1/02 ,  H05K3/06

CPC分类号： H05K1/0296 ,  H05K3/067 ,  H05K3/064

摘要： A wiring substrate includes a substrate, and a conductor layer formed on the substrate and including copper such that the conductor layer is patterned. The conductor layer is formed such that the upper surface of the conductor layer has a width that is equal to or larger than a width of the lower surface of the conductor layer and that the width of the lower surface is larger than the minimum width of a middle portion of the conductor layer between the upper surface and the lower surface.

公开(公告)号：US11979976B2

公开(公告)日：2024-05-07

申请号：US17383129

申请日：2021-07-22

申请人： CelLink Corporation

发明人： Kevin Michael Coakley ,  Malcolm Parker Brown ,  Dongao Yang ,  Michael Lawrence Miller ,  Paul Henry Lego

IPC分类号： H05K3/20 ,  H01M50/519 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28 ,  H05K3/46 ,  H05K3/04 ,  H05K3/44

CPC分类号： H05K1/0201 ,  H01M50/519 ,  H05K1/118 ,  H05K3/007 ,  H05K3/0073 ,  H05K3/06 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4623 ,  H05K3/046 ,  H05K3/064 ,  H05K3/44 ,  H05K3/445 ,  Y02E60/10

摘要： Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

公开(公告)号：US11845108B2

公开(公告)日：2023-12-19

申请号：US16827097

申请日：2020-03-23

申请人： FUJIFILM SONOSITE, INC.

发明人： N. Christopher Chaggares ,  Eric Rieder

IPC分类号： B06B1/06 ,  H10N30/063 ,  H10N30/87 ,  B06B1/02 ,  H05K1/02 ,  H05K3/06 ,  H05K3/32 ,  H05K1/18 ,  H05K3/02 ,  H05K3/30

CPC分类号： B06B1/0629 ,  B06B1/0207 ,  B06B1/0622 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/189 ,  H05K3/02 ,  H05K3/064 ,  H05K3/305 ,  H05K3/32 ,  H10N30/063 ,  H10N30/875 ,  H05K2203/0361

摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

公开(公告)号：US20230380071A1

公开(公告)日：2023-11-23

申请号：US18225692

申请日：2023-07-25

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC分类号： H05K3/00 ,  H01L21/48 ,  H05K3/06

CPC分类号： H05K3/007 ,  H01L21/4846 ,  H05K3/064

摘要： An electronic device is disclosed. The electronic device includes a circuit structure. The circuit structure includes a metal member and an insulating layer. The insulating layer surrounds the metal member and includes at least one recess. The metal member corresponds to the recess, the recess exposes a surface of the metal member, and a width of the recess is greater than a width of the metal member in a cross-sectional view of the metal member and the insulating layer.

公开(公告)号：US20180310412A1

公开(公告)日：2018-10-25

申请号：US15609131

申请日：2017-05-31

申请人： FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

发明人： LEI ZHOU ,  RUI-WU LIU ,  QIONG ZHOU

IPC分类号： H05K1/18 ,  H05K1/09 ,  H05K3/06 ,  H05K3/18 ,  H05K1/03

CPC分类号： H05K1/189 ,  H05K1/032 ,  H05K1/09 ,  H05K3/064 ,  H05K3/188 ,  H05K2203/0723 ,  Y10T29/49155

摘要： A flexible printed circuit board with reduced ion migration from signal-carrying elements which are coated against corrosion includes an insulating layer, a wiring area, a copper electroplating layer, a nickel electroplating layer, a cover film, and a gold chemical-plating layer. The wiring area is formed on the insulating layer. The copper electroplating layer formed on the wiring area has a first portion and a second portion. The nickel electroplating layer is formed on at least the first portion and exposes sidewalls of the first portion. The cover film is formed on the second portion and fills in gaps of the copper electroplating layer. The gold chemical-plating layer is formed on top surface of the nickel electroplating layer and the sidewalls of the first portion.

公开(公告)号：US20180239453A1

公开(公告)日：2018-08-23

申请号：US15957839

申请日：2018-04-19

申请人： Samsung Display Co., Ltd.

发明人： Ki Hyun CHO ,  Cheol Kyu KIM ,  Sung kyun PARK ,  Sun Haeng CHO

IPC分类号： G06F3/041 ,  G06F3/044 ,  H05K3/10 ,  H05K3/06

CPC分类号： G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01L21/0272 ,  H05K3/064 ,  H05K3/10

摘要： A touch panel and a method of manufacturing the touch panel are provided. The touch panel includes a substrate comprising a wiring area and a sensor area, a sensing pattern located on a surface of the substrate in the sensor area, and a wiring line located on the surface of the substrate in the wiring area and electrically connected to the sensing pattern. The sensing pattern includes a plurality of first fine metal lines arranged irregularly in a mesh, and a first photosensitive layer pattern residue located between at least two of the first fine metal lines.

公开(公告)号：US20180185922A1

公开(公告)日：2018-07-05

申请号：US15740589

申请日：2016-06-30

申请人： National Research Council of Canada

发明人： Zhiyi Zhang ,  Ye Tao ,  Ta-Ya Chu ,  Gaozhi Xiao

IPC分类号： B22F7/04 ,  B22F3/105 ,  B22F3/24 ,  B22F5/00

CPC分类号： B22F7/04 ,  B22F3/105 ,  B22F3/24 ,  B22F5/00 ,  B22F2003/247 ,  B22F2003/248 ,  B22F2301/052 ,  B22F2301/10 ,  B22F2301/255 ,  B82Y20/00 ,  G03F7/0043 ,  G03F7/2014 ,  G03F7/2022 ,  G03F7/40 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/0096 ,  H01L51/0541 ,  H01L51/0545 ,  H01L2251/301 ,  H05K1/097 ,  H05K3/06 ,  H05K3/064 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2203/013 ,  H05K2203/0548 ,  H05K2203/0766 ,  H05K2203/107 ,  H05K2203/1131

摘要： A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.

公开(公告)号：US09942990B2

公开(公告)日：2018-04-10

申请号：US15245361

申请日：2016-08-24

申请人： International Business Machines Corporation

发明人： Brian L. Carlson ,  John R. Dangler ,  Roger S. Krabbenhoft ,  Kevin A. Splittstoesser

IPC分类号： H05K3/02 ,  H05K3/26 ,  H01P3/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K1/09 ,  H05K3/38 ,  H05K3/06 ,  H05K1/03

CPC分类号： H05K3/26 ,  H01P3/02 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K3/06 ,  H05K3/064 ,  H05K3/382 ,  H05K3/46 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0391 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

公开(公告)号：US20180070452A1

公开(公告)日：2018-03-08

申请号：US15256757

申请日：2016-09-06

申请人： Unimicron Technology Corp.

发明人： Pu-Ju Lin ,  Shih-Lian Cheng ,  Yu-Hua Chen ,  Cheng-Ta Ko ,  Jui-Jung Chien ,  Wei-Tse Ho

IPC分类号： H05K3/06 ,  H05K3/10 ,  H05K3/42 ,  H05K3/24 ,  G03F7/16 ,  G03F7/20 ,  G03F7/09 ,  G03F7/32 ,  G03F7/40 ,  G03F1/50 ,  G03F1/76

CPC分类号： G03F1/50 ,  G01K7/24 ,  G01K15/007 ,  G03F7/2032 ,  G03F7/2047 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/107 ,  H05K3/1275 ,  H05K3/182 ,  H05K3/241 ,  H05K3/422

摘要： A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.