公开(公告)号：US11683891B2

公开(公告)日：2023-06-20

申请号：US17450591

申请日：2021-10-12

申请人： IBIDEN CO., LTD.

发明人： Yasuhiro Kawai

IPC分类号： H05K3/40 ,  H05K1/02

CPC分类号： H05K3/4038 ,  H05K1/0269 ,  H05K2203/166

摘要： A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.