公开(公告)号：US3928051A

公开(公告)日：1975-12-23

申请号：US42237873

申请日：1973-12-06

Applicant: IBM

Inventor： BROWNLOW JAMES M ,  BUCHANAN RELVA C ,  TUMMALA RAO R

IPC: H01J11/02 ,  C03C3/072 ,  C03C4/16 ,  H01B3/08 ,  C03C3/10 ,  C03C3/04 ,  C03C5/02

CPC classification number: H01B3/087 ,  C03C3/072 ,  C03C4/16

Abstract: A family of dielectric glasses having properties such that, when heat is applied to seal the dielectric glasses, there is no crazing in a MgO overcoat. These dielectric glasses have such viscosity properties as not to craze a MgO overcoat at a temperature of about 480*C corresponding approximately to log viscosity of 10.3 poises and yet fire into good dielectric films at about 610*C. The glass has substantially the following constitutents:

Abstract translation: 一种电介质玻璃系列，其特征在于，当施加热量以密封电介质玻璃时，在MgO外涂层中不会发生龟裂。 这些电介质玻璃具有这样的粘度特性，即在约480℃的温度下不会使MgO外涂层变热，对应于大约对数粘度为10.3泊，然后在约610℃下进入良好的介电膜。玻璃具有基本上以下的组成 ：}重量％} PbO 55.0-57.0} SiO2 12.0-14.0} B2O3 21.0-22.0} Al2O3 1.0-4.0} MgO 1.5-2.2} CaO 2.0-5.5} Na2O 1.8-2。

公开(公告)号：US3558332A

公开(公告)日：1971-01-26

申请号：US3558332D

申请日：1968-06-17

Applicant: IBM

Inventor： BUCHANAN RELVA C

IPC: C04B35/111 ,  C04B33/13 ,  C04B35/10 ,  C04B37/02 ,  H01B3/02 ,  H01G4/12 ,  C04B33/00

CPC classification number: C04B33/1315 ,  C04B33/13 ,  C04B35/10 ,  H01B3/025 ,  H01G4/1209 ,  H01G4/129

Abstract: AN ALUMINA DIELECTRIC OF FINE GRAINED STRUCTURE AND HIGH TENSILE STRENGTH CONTAINING FROM ABOUT 2% TO ABOUT 12% BY WEIGHT OF A GLASSY PHASE WHICH BONDS THE FINELY DIVIDED ALUMINA GRANS TOGETHER, THE GLASSY PHASE CONTAINING AT LEAST U% CALCIUM PHOSPHATE AND ONE OR MORE FLUX ADDITIVES, CONSISTING OF LITHIUM SILICATE, ZINC SILICATE, CALCIUM SILICATE OR MAGNESIUM SILICATE IN AN AMOUNT EQUAL TO THE CALDIUM PHOSPHATE AND FORMED THROUGH REACTIVE SINTERING AT FROM ABOUT 1350*C. UP TO 1460*C. WHICH IS 50-200* LESS THAN THAT OF ALUMINA PER SE (1550*C.). THE DIELECTRIC WHICH ADHERES TO NOBLE METALS IS CHARACTERIZED BY HIGH ELECTRICAL VOLUME RESISTIVITY OF 10**12-10**14 OHM-CM., LOW DISSIPATION FACTOR, LOW THERMAL EXPANSION FROM 65 TO 67.6 IN./IN.*C. AND HIGH DENSITY FROM 3.40 TO 3.86 GM.-CU. CC. THE SHRINKAGE OF THE PREFERRED EMBODIMENTS IS ABOUT 17.0-18.0% IN COMPARISON WITH A SHRINKAGE 18.5% FOR ALUMINA TO WHICH NO FLUX IS ADDED. SURFACE ROUGHNESS VALUES AS LOW AS 2 TO 4 MICROINCHES ARE ACHIEVED.