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公开(公告)号:US3700150A
公开(公告)日:1972-10-24
申请号:US3700150D
申请日:1971-06-08
Applicant: IBM
Inventor: CHENEY RAYMOND E
CPC classification number: B23D31/00 , B21D28/00 , B21D28/16 , B26D7/086 , G11B5/232 , Y10T83/04 , Y10T83/041 , Y10T83/97 , Y10T225/10 , Y10T225/30 , Y10T225/371 , Y10T225/386
Abstract: Thin metallic material is selectively cut by apparatus which subjects the material to complementary alternate displacement of a few microinches in a direction normal to its generally flat planar surface, the material stresses thus generated causing the metal to change state and fracture along the line of alternate displacement, the change in state occurring without the loss or distortion of material at the fracture.
Abstract translation: 薄金属材料被选择性地切割,其使材料在垂直于其大致平坦的平坦表面的方向上使几个微英寸互补交替位移,由此产生的材料应力导致金属沿着交替位移线的变化状态和断裂 ,发生状态的变化而不破坏材料的损失或扭曲。
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公开(公告)号:US2577070A
公开(公告)日:1951-12-04
申请号:US16306150
申请日:1950-05-19
Applicant: IBM
Inventor: CHENEY RAYMOND E
CPC classification number: G06K19/04
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公开(公告)号:US2615333A
公开(公告)日:1952-10-28
申请号:US16318250
申请日:1950-05-20
Applicant: IBM
Inventor: GARDINOR ELLIOTT W , CHENEY RAYMOND E , BLEUER LORIN T
CPC classification number: G06K5/00
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公开(公告)号:US2496579A
公开(公告)日:1950-02-07
申请号:US6934249
申请日:1949-01-05
Applicant: IBM
Inventor: CHENEY RAYMOND E , WAGNER JOHN L , LAWHEAD ROBERT E
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